Abstract: The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.

Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.

Abstract: An aluminum pouch film for a secondary battery is disclosed. The aluminum pouch film includes an aluminum film layer; an outer resin layer deposited on one surface of the aluminum film layer; and an inner resin layer deposited on the other surface of the aluminum film layer, wherein the inner resin layer comprises a polyolefin resin, an ethylene vinyl alcohol copolymer (EVOH) and a maleic anhydride polypropylene (MAHPP) resin.

Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.

Abstract: The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.

Abstract: An aluminum pouch film for a secondary battery is disclosed. The aluminum pouch film contains an aluminum film layer; an outer resin layer laminated on one surface of the aluminum film layer; and an inner resin layer laminated on the other surface of the aluminum film layer. The inner resin layer contains a polyolefin resin, an ethylene vinyl alcohol copolymer (EVOH) and an ionomer resin.

Abstract: The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

Abstract: The present invention relates to a surface modifier for electrolytic nickel plating including at least one carboxyl group-containing compound and a nickel electroplating solution including the surface modifier. The use of the nickel electroplating solution according to the present invention enables efficient formation of a plated nickel layer with high surface roughness and mattness even without performing strong electrolysis, unlike in the prior art.

Abstract: The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method of manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, so that a defect rate can be minimized.

Abstract: Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

Abstract: Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.

Abstract: Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

Abstract: Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.

Abstract: One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

Abstract: One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Abstract: Disclosed is an electroplating method for printed circuit board. The method includes: providing a printed circuit board including a circuit pattern, a pad part on which components are mounted, a terminal part for electrical connection to an external device, and a connector part; masking the portion of the printed circuit board other than the terminal part and the connector part; dipping the printed circuit board in a nickel-tungsten alloy plating solution including a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent, and a ductility improver; forming a nickel-tungsten alloy plated layer on each of the exposed portions of the terminal part and the connector part by direct-current (DC) electroplating; and forming a gold-containing plated layer on the nickel-tungsten alloy plated layer by DC electroplating.

Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Abstract: The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

Abstract: Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (—SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one —S—, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.