Abstract: A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a high-frequency area on the active surface. The substrate supports the first chip and is electrically connected to the first chip. The middle layer is disposed on the first chip and has a recess corresponding to the high-frequency area. The second chip is disposed on the middle layer and electrically connected to either the first chip or the substrate. The encapsulant encapsulates the first chip, the middle layer, the second chip, and a part of the substrate.

Abstract: A wire-winding device with smooth outlets comprises an upper cover; a lower cover; a rotary unit; a wire winding around the rotary unit; two sliding units installed at two ends of the wire-winding device and at the inner sides of the upper cover and lower cover; each sliding unit having two retaining shafts and two hollow rollers; two retaining shafts of one sliding unit being installed at one end of the lower cover; each retaining shaft being installed with a hollow roller; the upper cover having two retaining holes corresponding to the two retaining shafts of the lower cover; and a via hole being formed between two hollow rollers so that the wire passes through the via hole to protrude out of the wire-winding device.

Abstract: A wire-winding device comprises an upper cover. A center of the upper cover being formed with a via hole; a lower side of the upper cover being formed with a sector groove; a movable sheet being installed in a center of the sector groove; a front end of the movable sheet being installed with a block; the block being protruded from the movable sheet; a center of the rotary base having a via hole; a top of the rotary base being formed with an annular track; the block being embedded into the annular track; a spiral spring being positioned in a lower groove of the rotary base; a lower cover extended with a post at a center of one upper side of the lower cover; a side of the post having a trench for fixing the spiral spring; and a transmission line winding around the rotary base.

Abstract: The present invention relates to a data buffering method, and more particularly, relates to a data buffering method in a disc data reading system. According to the request of instructions, the disc data reading system reads disc data into a data buffer apparatus for later accessing and processing. In the data buffering method, according to a transmitted request of a first instruction, the data is read from the disc data reading system and is then buffered into the first area selected by the data buffer apparatus. According to a transmitted request of a second instruction, the data is read from the disc and is then buffered into the second area selected by the data buffer apparatus. The first area and the second area are located in different and non-overlapped areas inside the data buffer apparatus, so that the data in the first area will not be over-written during the process of data buffering in the second area. Those data in the data buffer apparatus could be read out directly for later issued instructions.

Abstract: A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a high-frequency area on the active surface. The substrate supports the first chip and is electrically connected to the first chip. The middle layer is disposed on the first chip and has a recess corresponding to the high-frequency area. The second chip is disposed on the middle layer and electrically connected to either the first chip or the substrate. The encapsulant encapsulates the first chip, the middle layer, the second chip, and a part of the substrate.

Abstract: A connector comprises an upper cover having a plurality of holes; each of two sides of the upper cover having a respective guide hole and a respective metal retaining elastomer; a top of the upper cover having at least one plastic injection holes; a middle cover having a plurality of via holes for positioning the wires of terminals to the holes of the upper cover; a body being located with a plurality of terminals; the terminals being inserted into the holes of the upper cover through the via holes of the middle cover; the terminals piercing through the wires so as to conduct the wires and the terminals; each of two sides of the body having a respective hook which is inserted into a respective one of the guide holes so as to buckle a respective one of the metal retaining elastomer. Adhesive is filled into the plastic injection holes.

Abstract: An impedance standard substrate for calibrating a vector network analyzer comprises a first surface and a second surface opposite to the first surface. A thru-circuit has two contacts electrically connected to each other. The two contacts are disposed on the first surface and the second surface, respectively. The impedance standard substrate further comprises a pair of open-circuits, a pair of short-circuits, and a pair of load-circuits disposed on the first surface and the second surface, respectively.