Abstract: A package substrate is provided, in which dielectric layers are formed on a core board, and a wiring layer is embedded in at least one of the dielectric layers, so that the wiring layer has better copper adhesion to prevent delamination problems. A method of fabricating the package substrate is also provided.

Abstract: Provided is an electronic package, in which an external connection structure is formed on a first side of a circuit structure, at least one circuit assembly electrically connected to the circuit structure and at least one electronic element electrically connected to the circuit structure are disposed on a second side of the circuit structure, and the circuit assembly and the electronic element are encapsulated by a cladding layer. The coefficients of thermal expansion (CTEs) of the circuit assembly and the cladding layer are both greater than the CTE of the circuit structure, and the CTE of the circuit structure is greater than the CTE of the external connection structure, so as to prevent the difference in CTEs between the first side and the second side of the circuit structure from being significantly changed, thereby preventing the electronic package from warpage.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: An electronic package is provided, in which a cover layer is embedded in a circuit structure to form a groove, and an electronic element is disposed on the cover layer in the groove. A cladding layer encapsulates the electronic element, and an external connection structure is disposed on the circuit structure and the cladding layer. Therefore, the electronic element is embedded in the groove, such that a thickness of the electronic package can be greatly reduced to meet the requirement of thinning.

Abstract: A system and a method for a secure trading mechanism combining wireless communication and wired communication are proposed, which, in the condition of two-way trading constructed based on network connection of a wireless communication device functioning in two-way transmission to a trading server and a trading host of a wired communication devices, allow the trading to be performed in real time and the correctness to be determined for data transmitted between different levels of the network according to a secure communication protocol defined in each communication device, so as to assure the security of trading data in transmission, and prevent the trading data from being acquired or changed without authorization.

Abstract: The convention transmission method is an on-demand data communication, in which one discloses a demand and one provides a supply. However, this communication way is not suitable nowadays. Since amount of current data transmission is very large. In order to improve the quality in service, the service provider provides actively the required service to the customer. After browsing by the customer, then the customer transfers the selection items to the service provider and then the service provider provides required service to the customers, By this way, the customer may browse products rapidly and the quality of information service is improved.

Abstract: A system and a method for a secure trading mechanism combining wireless communication and wired communication are proposed, which, in the condition of two-way trading constructed based on network connection of a wireless communication device functioning in two-way transmission to a trading server and a trading host of a wired communication devices, allow the trading to be performed in real time and the correctness to be determined for data transmitted between different levels of the network according to a secure communication protocol defined in each communication device, so as to assure the security of trading data in transmission, and prevent the trading data from being acquired or changed without authorization.