Abstract: A cluster type semiconductor processing apparatus and a method for manufacturing a semiconductor device using the same are provided. The cluster type semiconductor processing apparatus includes a polyhedral transfer module to transfer a wafer, a first process module communicating with the transfer module, a degassing process of removing fumes from a surface of the wafer being performed in the first process module, a second process module communicating with the transfer module, a plasma cleaning process of cleaning the surface of the wafer being performed in the second process module, a standby module communicating with the transfer module, the wafer having undergone the degassing process and the plasma cleaning process being maintained in the standby module for a certain time, and a third process module communicating with the transfer module, a metal sputtering process of depositing a metal film on the wafer being performed in the third process module.

Abstract: Disclosed is an elastic make-up cosmetic composition containing a silicone elastomer. More particularly, the make-up cosmetic composition includes a powder type silicone elastomer, powder extender pigment, hydrocarbon gel, anhydrous silicone oil and organic dispersant oil. A silicone elastomer of a surface-treated powder type and a polymer are used to improve the dispersibility of silicone elastomer when producing a cosmetic composition. As a result, it is possible to provide a make-up cosmetic composition having a silky and soft elastic feel. The resultant cosmetic composition is adhered to the skin smoothly, has a good elastic feel and spreadability and shows little dust flying.

Abstract: Disclosed is an elastic make-up cosmetic composition containing a silicone elastomer. More particularly, the make-up cosmetic composition includes a powder type silicone elastomer, powder extender pigment, hydrocarbon gel, anhydrous silicone oil and organic dispersant oil. A silicone elastomer of a surface-treated powder type and a polymer are used to improve the dispersibility of silicone elastomer when producing a cosmetic composition. As a result, it is possible to provide a make-up cosmetic composition having a silky and soft elastic feel. The resultant cosmetic composition is adhered to the skin smoothly, has a good elastic feel and spreadability and shows little dust flying.

Abstract: A sound output apparatus configured to connect to an audio processing apparatus may include a communication interface which receives an audio signal from the audio processing apparatus through a wireless communication; a speaker which outputs the received audio signal; an input unit which receives a user control command; and a controller which controls the communication interface so that the received control command is transmitted to the audio processing apparatus through the communication interface.

Abstract: A method to automatically match keys between music being reproduced and music being performed includes detecting a key from an audio signal being reproduced from a storage medium or audio source, detecting a key from a sound signal representing music being played by a user, and performing a transposition by adjusting the key of the audio signal to match the key of the sound signal.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.

Abstract: A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer.

Abstract: A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.

Abstract: The present invention relates to a remote control of a portable terminal, and more particularly, to a method for remotely controlling functions of a portable terminal, and a system thereof. A method for remotely controlling a function of a portable terminal includes receiving a request for remote control of at least one function of the portable terminal, setting up the requested at least one function for remote control, determining whether an event corresponding to the set up function is generated and performing the set up function if the event is generated.

Abstract: A remote control system and method are disclosed that can remotely control user data stored in a remote portable terminal. The system includes a slave terminal, set in a remote control function, for storing the user data, and a master terminal for requesting the user data from the slave terminal and receiving it. The slave terminal authenticates the master terminal when the master terminal requests the user data therefrom, compresses the requested user data, according to the size of user data, during the authentication, and transmits the compressed user data to the master terminal.

Abstract: A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

Abstract: A portable device remote control method and system are provided. The method includes registering an Internet Protocol (IP) address in an IP network, by a portable device, forming a transport control protocol based communications channel with the portable device based on the IP network and the IP address, by an internet access terminal, transmitting a control signal for activating an application program of the portable device by using the transport control protocol based communications channel, by the internet access terminal, activating the application program according to the control signal, by the portable device, and receiving screen information according to the activated application program from the portable device by using the transport control based communication system, and outputting the received screen information, by the internet access terminal.

Abstract: A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

Abstract: A method to automatically match keys between music being reproduced and music being performed includes detecting a key from an audio signal being reproduced from a storage medium or audio source, detecting a key from a sound signal representing music being played by a user, and performing a transposition by adjusting the key of the audio signal to match the key of the sound signal.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.

Abstract: This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board.

Abstract: This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity.

Abstract: A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

Abstract: Disclosed herein is a hair growth-stimulating composition containing a non-polar solvent-soluble extract fraction of Cantharis as an active ingredient. The composition shows an excellent hair growth activity with minimal skin irritation compared to conventional ones. It can be used for hair growth in various fields, including medical and non-medical supplies and cosmetics.

Abstract: A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.