Abstract: Provided is a method of forming a micropattern according to an aspect of the present invention. The method of forming a micropattern may include forming an organic wire or organic-inorganic hybrid wire mask pattern having a circular or elliptical cross section on a substrate, forming a material layer on an entire surface of the substrate having the organic wire or organic-inorganic hybrid wire mask pattern formed thereon, and removing the organic wire or organic-inorganic hybrid wire mask pattern from the substrate to allow only the material layer on a portion of the substrate having no organic wire or organic-inorganic hybrid wire mask pattern formed thereon to be remained.

Abstract: Provided according to an aspect of the present disclosure is an electric field aided robotic nozzle printer including a solution storage apparatus for supplying a discharging solution; a nozzle for discharging the discharging solution supplied by the solution storage apparatus; a voltage applying apparatus for applying high voltage onto the nozzle; a flat and movable collector, in which organic wires formed after discharge from the nozzle are aligned; a robot stage, which is installed below the collector and enables to move the collector in an x-y direction (horizontal direction) within a horizontal plane; a micro distance controller for regulating the distance between the nozzle and the collector in a Z direction (vertical direction); and a base plate, which is installed below the robot stage, for maintaining flatness of the collector and preventing vibration generated during the operation of the robot stage.

Abstract: Provided is a method of forming a micropattern according to an aspect of the present invention. The method of forming a micropattern may include forming an organic wire or organic-inorganic hybrid wire mask pattern having a circular or elliptical cross section on a substrate, forming a material layer on an entire surface of the substrate having the organic wire or organic-inorganic hybrid wire mask pattern formed thereon, and removing the organic wire or organic-inorganic hybrid wire mask pattern from the substrate to allow only the material layer on a portion of the substrate having no organic wire or organic-inorganic hybrid wire mask pattern formed thereon to be remained.