Abstract: A lamp driving method and an inverter for driving the lamp are disclosed which can stably maintain a desired duty ratio of a pulse width modulation (PWM) signal for controlling driving of a lamp. The method for driving lamp, comprising: generating an inner pulse width modulation (PWM) signal; outputting a DC level in response to a duty ratio of an external PWM signal; selectively outputting the external PWM signal or the inner PWM signal in accordance with the DC level; and generating an AC drive signal Acs in response to the external PWM signal or the inner PWM signal, and supplying the AC drive signal to the lamp.

Abstract: The present invention related to an electronic organ type accelerator pedal. The electronic organ type accelerator pedal according to the present invention is capable of enhancing stability by the compression spring having a double structure and the carrier restricting the reverse rotation of the foot plate, while maintaining the benefit of the electronic accelerator pedal which is capable of ensuring space, improving an operation feeling and reducing driver's fatigue since the electronic accelerator pedal is not influenced by tension changes of the cable, and improving fuel efficiency by improving fuel consumption rate.

Abstract: A wiring substrate having variously sized ball pads, a semiconductor package including the wiring substrate, and a stack package using the semiconductor package, to improve board level reliability (BLR) of a semiconductor package or stack package mounted on a mother board are shown. Outer ball pads are formed to have relatively greater surface areas at the corners of the semiconductor package as compared to those at other areas and are formed to have the greatest surface area within a designable range. Additionally, occurrence of cracks may be inhibited at junctions of other solder balls by forming dummy solder pads at the outermost corners among the outer ball pads formed proximate to the corners of the wiring substrate. Stress arising during a board level reliability test is absorbed without product failure at junctions between the dummy solder pads and dummy solder balls.

Abstract: A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.

Abstract: An apparatus of driving a lamp includes a first inverter board having a first inverter for supplying a first high-voltage alternating-current waveform via a first high-voltage line to a first electrode of the lamp, and a second inverter board having a second inverter for supplying a second high-voltage alternating-current waveform via a second high-voltage line to a second electrode of the lamp, the second inverter being different from the first inverter.

Abstract: A lamp guide holder includes a horizontal part that has a front surface and a rear surface, a fixing part that extends from the rear surface, and at least one lamp holding part on the front surface and having a ring shape. The lamp holding part has at least one protrusion on an inner surface thereof. The lamp guide holder further comprises a supporting part that extends from the front surface.

Abstract: Disclosed is a semiconductor device packaging technique that is capable of resolving a problem of instability of bonding wires when stacking a plurality of semiconductor chips. The technique is also capable of realizing a slim, light and small package. The semiconductor device package includes a substrate having a substrate pad on a surface thereof, one or more memory chips stacked on the substrate with each memory chip having a pad connected to a common pin receiving a common signal applied to all the memory chips, an interposer chip stacked on the substrate and having an interconnection wire connected to the memory chip pad, the common pin of each of the memory chips being electrically connected to the interconnection wire via the memory chip pad, and a logic chip stacked on the substrate and having a bypass circuit which electrically connects or disconnects the interconnection wire to or from the substrate pad.

Abstract: Covers are provided with a detachable portion for being separated from each other during the deployment of a cushion, thus facilitating the deployment of the cushion. A guide made of a flexible material encloses the outer periphery of the covers in which one end of the guide is fixed to an outer surface of a cover outer portion facing the exterior in relation to the detachable portion, and the other end of the guide is detachably attached to the outer surface of a cover inner portion facing the vehicle inside in relation to the detachable portion for deploying into the passenger compartment with the cushion during the expansion of the cushion and shrouding an upper end of a center pillar trim. This configuration prevents the deformation of the center pillar trim or collision of the cushion with the center pillar trim during the deployment of the curtain airbag.

Abstract: A cathode ray tube comprises a panel; a funnel engaged to the panel for forming a vacuous space; and a shadow mask supported in the cathode ray tube by being fixed to a mask frame and including an effective surface having a plurality of electron beam passing holes at a center thereof, an ineffective surface formed at a periphery of the effective surface and not having the electron beam passing holes and a skirt portion extended from the ineffective surface towards a vertical direction thereof and welded to the mask frame. In the cathode ray tube, a slot of a predetermined size is formed between welding points by which the skirt portion is welded to the mask frame, and a height of the slot from an end of the skirt portion is higher than a height of the welding points, thereby reducing a doming effect of the shadow mask, reducing a mis-landing which the electron beam does not land to a precise landing point, and thus preventing a color purity of a screen from being deteriorated.

Abstract: Disclosed herein is a face mask comprising a health-promoting resin. The face mask comprises a fibrous pad covering wearer's nose and mouth, and a pair of loops attached to both sides of the fibrous pad so as to hang them on both ears, respectively, wherein the pad is composed of an inner layer, an outer layer combined with the inner layer and a health-promoting resin interposed between the inner and outer layers. The face mask can substantially prevent microorganisms from entering the wearer's body by antimicrobial processing, thereby improving the wearer's health and promoting blood circulation to activate various cellular functions and growth-promoting effects in the wearer's body by far-infrared rays and anions generated in an appropriate amount from the health-promoting resin.

Abstract: A cathode ray tube comprising: a panel; a funnel engaged to the panel for forming a vacuous space; and a shadow mask supported in the cathode ray tube by being fixed to a mask frame and including an effective surface having a plurality of electron beam passing holes at a center thereof, an ineffective surface formed at a periphery of the effective surface and not having the electron beam passing holes and a skirt portion extended from the ineffective surface towards a vertical direction thereof and welded to the mask frame. In the cathode ray tube, a slot of a predetermined size is formed between welding points by which the skirt portion is welded to the mask frame, and a height of the slot from an end of the skirt portion is higher than that of the welding points, thereby reducing a doming effect of the shadow mask, reducing a mis-landing which the electron beam does not land to a precise landing point, and thus preventing a color purity of a screen from being deteriorated.