Patents by Inventor Sung-Yu LIN

Sung-Yu LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seal ring for bonded dies
    Patent number: 10515908
    Abstract: A device includes first and second dies and a seal ring. The first die includes a top dielectric layer. The second die is over the first die. The second die includes a bottom dielectric layer bonded to the top dielectric layer of the first die at an interface between the first die and the second die. The seal ring extends from the first die to the second die through the interface. A portion of the top dielectric layer of the first die and a portion of the bottom dielectric layer of the second die are separated by a gap outside the seal ring.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ya-Chun Teng, Sung-Yu Lin, Chien-Ming Sung
  • SEAL RING FOR BONDED DIES
    Publication number: 20190131255
    Abstract: A device includes first and second dies and a seal ring. The first die includes a top dielectric layer. The second die is over the first die. The second die includes a bottom dielectric layer bonded to the top dielectric layer of the first die at an interface between the first die and the second die. The seal ring extends from the first die to the second die through the interface. A portion of the top dielectric layer of the first die and a portion of the bottom dielectric layer of the second die are separated by a gap outside the seal ring.
    Type: Application
    Filed: October 31, 2017
    Publication date: May 2, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ya-Chun TENG, Sung-Yu LIN, Chien-Ming SUNG