Abstract: The invention provides a digital printing machine characterized by an innovative cantilever assembly that significantly enhances precision and efficiency in digital printing. The cantilever assembly utilizes a structurally optimized cantilever frame to achieve superior printing quality through precise component positioning. It features a novel dual slide rail system, consisting of first and second slide rails, sliders, and drivers, to ensure flexible and accurate nozzle movement. This configuration not only minimizes the machine's operational footprint but also maximizes print area utilization. The integration of the cantilever assembly into the digital printing machine facilitates high-quality, continuous printing across various textiles, surpassing traditional methods. Furthermore, the invention encompasses a continuous printing apparatus that incorporates this machine, along with a rotary conveying device, to automate the sequential printing process, thus addressing spatial and mechanical challenges.

Abstract: A package substrate is adapted to a ball grid array package. The substrate includes two substrate contacts, two solder ball pads, two via holes and two signal lines. A connection line of the two substrate contacts is substantially perpendicular to a connection line of the two solder ball pads. The two substrate contacts are respectively connected to the two via holes by the two signal lines. Each signal line includes a circuit trace section, an approaching section and a bifurcating section connected in sequence. The two circuit trace sections of each signal line are substantially arranged in parallel. The two approaching sections are substantially arranged in parallel and substantially symmetrical about the connection line of the solder ball pads. The two bifurcating sections are substantially symmetrical about the pad connection line and respectively electrically connected to the two via holes.

Abstract: A package substrate is adapted to a ball grid array package. The substrate includes two substrate contacts, two solder ball pads, two via holes and two signal lines. A connection line of the two substrate contacts is substantially perpendicular to a connection line of the two solder ball pads. The two substrate contacts are respectively connected to the two via holes by the two signal lines. Each signal line includes a circuit trace section, an approaching section and a bifurcating section connected in sequence. The two circuit trace sections of each signal line are substantially arranged in parallel. The two approaching sections are substantially arranged in parallel and substantially symmetrical about the connection line of the solder ball pads. The two bifurcating sections are substantially symmetrical about the pad connection line and respectively electrically connected to the two via holes.