Abstract: Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.

Abstract: Provided herein is a method for manufacturing a polyimide film, the method including the steps of: preparing a polyamic acid solution; preparing a polyamic acid composition by adding a dehydrating agent and an imidizing catalyst to the polyamic acid solution; and applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater, wherein the thermosetting step comprises a first heating step, a second heating step, and a third heating step, each of the first, the second, and the third step being carried out in a processing temperature range of 100° C. to 550° C.

Abstract: Disclosed herein are a highly thick polyimide film that contains a reduced number of bubbles therein and exhibits high elasticity and high heat resistance, and a manufacturing method therefor. The polyimide film is obtained by imidizing a poly(amic acid) solution containing an acid dianhydride component including 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including 4,4?-oxydianiline (ODA), para-phenylenediamine (p-phenylenediamine, PPD), and 3,5-diaminobenzoic acid (DABA), and contains a phosphorus (P)-based compound.

Abstract: Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.

Abstract: Disclosed herein is provided a method for manufacturing a polyimide film, the method comprising the steps of: preparing a polyamic acid solution; preparing a polyamic add composition by adding 2-3 mole equivalents of a dehydrating agent to the polyamic acid solution; and applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater.