Abstract: Disclosed is a thin film circuit substrate and a manufacturing method thereof, which are capable of forming a pattern having a feature size of less than 10 ?m by forming a seed layer and a plating layer on a base substrate and then forming, through electrospinning, a photoresist layer having a thickness in a set range. The disclosed thin film circuit substrate comprises: a base substrate; a thin film seed layer formed on the top surface of the base substrate; a metal layer formed on the top surface of the thin film seed layer; and a photoresist layer formed on the top surface of the metal layer, wherein the thickness of the photoresist layer is in a range of 1 ?m to 5 ?m.

Abstract: The present invention provides a method for manufacturing a thin film foil, wherein a metal thin film layer is formed on a base substrate through a vacuum deposition process to form an ultra-thin film foil having a thickness of 5 ?m or less, preferably 2 ?m or less. The provided method for manufacturing a thin film foil comprises the steps of: preparing a base substrate having release properties; preparing a metal raw material; vacuum-depositing the metal raw material on the base substrate to form a metal layer on the base substrate; and separating the base substrate from the metal layer to form a thin film foil, wherein one of a BeCu alloy, a Cu—Ag—Cr ternary alloy, an Ag alloy, a CuMo alloy, and a CuFeP alloy is prepared as the metal raw material.

Abstract: Disclosed are a touch screen sensor and a touch screen panel having the same, wherein an antenna electrode is formed in a dummy region between touch sensing electrodes, thereby preventing visibility degradation of the touch screen panel and performing touch sensing and an antenna function. The touch screen sensor includes: a base member made of a transparent material; an upper circuit pattern composed of multiple first sensing electrodes spaced apart from each other and formed on a first surface of the base member; a lower circuit pattern composed of multiple second sensing electrodes spaced apart from each other and formed on a second surface of the base member; and an antenna electrode formed on the first surface of the base member and formed in a dummy space defined between the multiple first sensing electrodes.

Abstract: Disclosed are a method for fabricating a printed circuit board wherein through-holes are formed in an organic substrate, followed by forming micro-circuit patterns through sputtering and plating, whereby the printed circuit board has low permittivity properties and enables high-speed processing, and a printed circuit board fabricated thereby. The disclosed method for fabricating a printed circuit board comprises the steps of: preparing a base substrate; forming a through-hole perforating the base substrate; forming a thin seed layer on the base substrate and in the through-hole; forming a thin plate layer on the thin seed layer; and etching the thin seed layer and the thin plate layer to form a micro-circuit pattern, wherein the base substrate is one selected from an organic substrate, FR-4, and Prepreg.

Abstract: Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated.

Abstract: Disclosed are a method for fabricating a printed circuit board wherein through-holes are formed in an organic substrate, followed by forming micro-circuit patterns through sputtering and plating, whereby the printed circuit board has low permittivity properties and enables high-speed processing, and a printed circuit board fabricated thereby. The disclosed method for fabricating a printed circuit board comprises the steps of: preparing a base substrate; forming a through-hole perforating the base substrate; forming a thin seed layer on the base substrate and in the through-hole; forming a thin plate layer on the thin seed layer; and etching the thin seed layer and the thin plate layer to form a micro-circuit pattern, wherein the base substrate is one selected from an organic substrate, FR-4, and Prepreg.

Abstract: Disclosed is a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured thereby, which minimizes a dielectric loss due to a high frequency signal and preventing a loss of the high frequency signal. The disclosed method for manufacturing the flexible printed circuit board according to an embodiment of the present disclosure includes preparing a base sheet; preparing a bonding sheet having a melting temperature lower than a melting temperature of the base sheet; forming a laminate by stacking the base sheet and the bonding sheet; and bonding by heating and pressurizing the laminate.

Abstract: A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.

Abstract: Disclosed are a touch screen sensor and a touch screen panel having the same, wherein an antenna electrode is formed in a dummy region between touch sensing electrodes, thereby preventing visibility degradation of the touch screen panel and performing touch sensing and an antenna function. The touch screen sensor includes: a base member made of a transparent material; an upper circuit pattern composed of multiple first sensing electrodes spaced apart from each other and formed on a first surface of the base member; a lower circuit pattern composed of multiple second sensing electrodes spaced apart from each other and formed on a second surface of the base member; and an antenna electrode formed on the first surface of the base member and formed in a dummy space defined between the multiple first sensing electrodes.

Abstract: A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.

Abstract: Disclosed is a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured thereby, which minimizes a dielectric loss due to a high frequency signal and preventing a loss of the high frequency signal. The disclosed method for manufacturing the flexible printed circuit board according to an embodiment of the present disclosure includes preparing a base sheet; preparing a bonding sheet having a melting temperature lower than a melting temperature of the base sheet; forming a laminate by stacking the base sheet and the bonding sheet; and bonding by heating and pressurizing the laminate.

Abstract: Disclosed is a thin film circuit substrate and a manufacturing method thereof, which are capable of forming a pattern having a feature size of less than 10 ?m by forming a seed layer and a plating layer on a base substrate and then forming, through electrospinning, a photoresist layer having a thickness in a set range. The disclosed thin film circuit substrate comprises: a base substrate; a thin film seed layer formed on the top surface of the base substrate; a metal layer formed on the top surface of the thin film seed layer; and a photoresist layer formed on the top surface of the metal layer, wherein the thickness of the photoresist layer is in a range of 1 ?m to 5 ?m.

Abstract: Disclosed is a method for manufacturing a substrate for a touch screen panel in which a signal line pattern having a fine line width may be formed by forming a thin film deposition in a bezel region of a transparent substrate and forming a photoresist layer on a thin film deposition layer through an electrospinning process. The disclosed method for manufacturing a substrate for a touch screen panel comprises the steps of: preparing a plate-shaped transparent substrate having a sensing region and a bezel region located on the outer periphery of the sensing region; forming a transparent electrode layer in the sensing region of the transparent substrate; forming a thin film deposition layer in the bezel region of the transparent substrate; and forming a photoresist layer on an upper surface of the thin film deposition layer through an electrospinning process.

Abstract: The present disclosure relates to an apparatus for sensing touch pressure. The apparatus for sensing touch pressure, according to one mode of the present disclosure, includes: a first substrate provided with a first electrode unit formed thereon; a second substrate provided with a second electrode unit formed thereon; and a porous membrane member provided between the first substrate and the second substrate and deformed or restored according to touch pressure applied to the first substrate.

Abstract: Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated.

Abstract: A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.

Abstract: The present disclosure relates to an apparatus for sensing touch pressure. The apparatus for sensing touch pressure, according to one mode of the present disclosure, includes: a first substrate provided with a first electrode unit formed thereon; a second substrate provided with a second electrode unit formed thereon; and a porous membrane member provided between the first substrate and the second substrate and deformed or restored according to touch pressure applied to the first substrate.

Abstract: A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.

Abstract: The present invention relates to a touch sensor for a touch screen panel, a method for manufacturing the touch sensor, and a touch screen panel including the touch sensor. The method includes: forming an electrode layer on a transparent substrate; forming a nanofiber layer on the electrode layer through electrospinning; and forming a porous electrode layer by etching the electrode layer using the nanofiber layer as an etching mask. Through this method, a touch sensor including a touch sensing circuit pattern provided with a plurality of exposure pores to expose the transparent substrate therethough is produced. Due to the pores formed in the touch sensing circuit pattern, visibility is ensured and durability and flexibility are improved. Furthermore, due to irregularity of line patterns of the touch sensing circuit pattern, a moire problem is solved and visibility of a touch screen panel is dramatically improved.

Abstract: Disclosed are a flexible printed circuit board and a method of manufacturing the same, wherein a deposition seed layer is formed on a substrate, a circuit cover layer having a circuit pattern groove in the shape of a circuit pattern is formed on the deposition seed layer, the circuit pattern groove is plated with a circuit plating layer, followed by etching, thus forming a circuit pattern, thereby realizing low-resistance characteristics, reducing manufacturing costs through a simple and easy manufacturing process, and increasing productivity.