Patents by Inventor Sung-Bum Kim
Sung-Bum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240380069Abstract: A battery pack includes a module assembly including a plurality of battery modules each including, on a side, a module opening through which venting gas is discharged, a pack cover facing the module opening and configured to cover the side of the module assembly, and an oxygen introduction preventing member located in a space formed between the module assembly and the pack cover and configured to prevent oxygen from being reversely introduced after venting gas is discharged in an extension direction of the space.Type: ApplicationFiled: December 27, 2022Publication date: November 14, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Seung-Hyun KIM, Young-Hoo OH, Seung-Min OK, Sang-Hyun JO, Young-Bum CHO, Sung-Goen HONG
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Publication number: 20240380062Abstract: A battery pack includes a module assembly including a plurality of battery modules arranged in a first direction, a vent channel located on a surface of the module assembly and configured to communicate with each of the plurality of battery modules, and a discharge delay member provided in the vent channel and configured to delay discharge of venting gas generated in at least some of the plurality of battery modules and introduced into the vent channel.Type: ApplicationFiled: December 27, 2022Publication date: November 14, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Seung-Hyun KIM, Young-Hoo OH, Seung-Min OK, Sang-Hyun JO, Young-Bum CHO, Sung-Goen HONG
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Patent number: 12141024Abstract: A failure mode and effect analysis system according to the present invention may include: a failure severity calculation unit for calculating a failure severity by using machine learning on the basis of safety analysis information; a failure frequency calculation unit for calculating a failure frequency by using machine learning on the basis of safety analysis information; and a failure detectivity calculation unit for calculating a failure detectivity by using machine learning on the basis of safety analysis information.Type: GrantFiled: June 30, 2022Date of Patent: November 12, 2024Assignee: VWAY CO., LTDInventors: Kyung Hyun Roh, Hong Bum Kim, Sung Nam Kim
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Publication number: 20240346681Abstract: A electronic device and method for providing store payment service are provided. An electronic device for providing store payment service comprising a processor; and a memory operatively coupled to the processor, wherein the memory, when executed, causes the processor to identify first tracking data of the tracking data corresponding to a first time period including the trigger time point, identify a user candidate group for at least some of the at least one user based on the first tracking data, calculate a first reliability for each of the at least some users included in the user candidate group, identify that a user related to the trigger is a first user based on the first reliability, and store instructions for performing an update related to the trigger for a virtual shopping cart of the first user.Type: ApplicationFiled: October 26, 2023Publication date: October 17, 2024Applicant: FAINDERS.AI INC.Inventors: Suk Bum HONG, Myung Won HAM, Byung Hun LEE, Su Min LIM, Sung Bin PARK, Ji Hyun KIM, Hyung Jun AHN
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Publication number: 20240301267Abstract: The present application can provide a curable composition capable of securing processability due to excellent blending properties with a filler while having little viscosity change with time and for forming a cured product having excellent electrical insulation performance, and can provide a device comprising, between an exothermic element and a cooling region, a cured product of a tow-component curable composition including the curable composition in thermal contact with both.Type: ApplicationFiled: January 26, 2022Publication date: September 12, 2024Applicants: LG Chem, Ltd., LG Chem, Ltd.Inventors: Sol Yi Lee, Je Sik Jung, Hyoung Sook Park, Jin Hyeok Won, Hye Jin Kim, Sung Bum Hong, Jong Hun Choi, Sang Hyuk Seo, Jae Min Jung
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Publication number: 20240292615Abstract: A semiconductor device includes a gate structure including a cell region and a contact region, a slit structure configured to extend in a first direction through the gate structure, first channel structures disposed in the cell region of the gate structure, and second channel structures disposed in the cell region of the gate structure and disposed to be more adjacent to the contact region of the gate structure than the first channel structures. In a second direction that intersects the first direction, the first channel structures may be spaced apart from the slit structure by a first distance, and the second channel structures may be spaced apart from the slit structure at a second distance.Type: ApplicationFiled: June 22, 2023Publication date: August 29, 2024Applicant: SK hynix Inc.Inventors: Sung Wook JUNG, Jong Hun KIM, Byung Soo PARK, Sang Bum LEE, Song Hee HAN
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Patent number: 12068042Abstract: A multi time program device with a power switch and a non-volatile memory implementing the power switch for multi time program is provided. The device performs a program operation or an erase operation of a non-volatile memory cell in a non-volatile memory device.Type: GrantFiled: December 7, 2021Date of Patent: August 20, 2024Assignee: SK keyfoundry Inc.Inventors: Jin Hyung Kim, Sung Bum Park, Kee Sik Ahn
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Publication number: 20240264893Abstract: A failure mode and effect analysis system according to the present invention may include: a failure severity calculation unit for calculating a failure severity by using machine learning on the basis of safety analysis information; a failure frequency calculation unit for calculating a failure frequency by using machine learning on the basis of safety analysis information; and a failure detectivity calculation unit for calculating a failure detectivity by using machine learning on the basis of safety analysis information.Type: ApplicationFiled: June 30, 2022Publication date: August 8, 2024Inventors: Kyung Hyun Roh, Hong Bum Kim, Sung Nam Kim
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Publication number: 20240258605Abstract: A battery module includes a plurality of battery cells, at least one cooling channel provided on at least one side of the plurality of battery cells and through which a coolant for cooling the plurality of battery cells flows, and at least one cooling fin unit disposed in contact with the at least one cooling channel and having at least one support rib for supporting the at least one cooling channel.Type: ApplicationFiled: December 9, 2022Publication date: August 1, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Young-Hoo OH, Seung-Hyun KIM, Seung-Min OK, Sang-Hyun JO, Young-Bum CHO, Sung-Goen HONG
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Publication number: 20240250377Abstract: A battery pack has improved safety. The battery pack includes a battery module having at least one battery cell; and a thermal runaway suppression unit mounted to one side of the battery module and configured to form a positive pressure inside the battery module when an abnormal situation occurs in any one battery cell.Type: ApplicationFiled: December 21, 2022Publication date: July 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Seung-Hyun KIM, Young-Hoo OH, Seung-Min OK, Sang-Hyun JO, Young-Bum CHO, Sung-Goen HONG
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Publication number: 20230335476Abstract: A semiconductor package includes a wiring structure including a first insulating layer and a first wiring pad. The first wiring pad is in the first insulating layer. The package includes a semiconductor chip on the wiring structure, and an interposer on the semiconductor chip. The interposer includes a second insulating layer and a second wiring pad, and the second wiring pad is in the second insulating layer. The package includes a first connecting structure including a first metal layer and a second metal layer surrounding the first metal layer. The first metal layer includes a lower metal layer adjacent to the wiring structure and an upper metal layer adjacent to the interposer, and the first connecting structure connects the first wiring pad and the second wiring pad. The package includes a mold layer between the wiring structure and the interposer.Type: ApplicationFiled: February 6, 2023Publication date: October 19, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Dae Hun Lee, Sung Bum Kim, Yun Seok Choi
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Publication number: 20230076184Abstract: A semiconductor package is provided. A semiconductor package includes a wiring structure, which includes a first insulating layer and a first wiring pad inside the first insulating layer a semiconductor chip on the wiring structure, an interposer having one surface facing the semiconductor chip and including a second insulating layer and a second wiring pad inside the second insulating layer, a connecting member connecting the first wiring pad and the second wiring pad, a support member in the first recess and between the wiring structure and the interposer, and a mold layer covering the semiconductor chip. One surface of the wiring structure includes a first recess exposing at least a part of the first insulating layer.Type: ApplicationFiled: July 28, 2022Publication date: March 9, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Jong Bo SHIM, Sung Bum KIM, Ji Hwang KIM
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Publication number: 20220287806Abstract: A disposable dental articulator is proposed. The disposable dental articulator includes a body, a socket coupled to the body and a fixing portion one side of which is slidably coupled to the first socket and the other side of which is configured to be coupled to one of a maxillary dental model and a mandibular dental model.Type: ApplicationFiled: March 15, 2021Publication date: September 15, 2022Inventors: YUNSOON KIM, BRIAN SUNG BUM KIM
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Publication number: 20160089442Abstract: There are provided a lyophilized preparation of botulinum toxin without a protein stabilizer derived from animals. The lyophilized preparation of botulinum toxin according to the present invention can maintain an activity of botulinum toxin, and also exhibit excellent long-term storage stability even under conditions of high temperature, which may occur when botulinum toxin is stored, delivered, and processed.Type: ApplicationFiled: November 30, 2015Publication date: March 31, 2016Inventors: Hyun Ho Jung, Gi Hyeok Yang, Chang Hoon Rhee, Hack Woo Kim, Sung Bum Kim, Seung Hwan Baek
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Patent number: 9198958Abstract: There are provided a lyophilized preparation of botulinum toxin without a protein stabilizer derived from animals. The lyophilized preparation of botulinum toxin according to the present invention can maintain an activity of botulinum toxin, and also exhibit excellent long-term storage stability even under conditions of high temperature, which may occur when botulinum toxin is stored, delivered, and processed.Type: GrantFiled: November 5, 2014Date of Patent: December 1, 2015Assignee: Medy-Tox Inc.Inventors: Hyun Ho Jung, Gi Hyeok Yang, Chang Hoon Rhee, Hack Woo Kim, Sung Bum Kim, Seung Hwan Baek
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Patent number: D1005451Type: GrantFiled: September 23, 2021Date of Patent: November 21, 2023Assignee: ESSEN TECH CO., LTD.Inventors: Sung Bum Kim, Ha Yeong Seong, Jung Hoon Choi
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Patent number: D1006088Type: GrantFiled: September 23, 2021Date of Patent: November 28, 2023Assignee: ESSEN TECH CO., LTD.Inventors: Sung Bum Kim, Ha Yeong Seong, Jung Hoon Choi
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Patent number: D1006089Type: GrantFiled: September 24, 2021Date of Patent: November 28, 2023Assignee: ESSEN TECH CO., LTD.Inventors: Sung Bum Kim, Ha Yeong Seong, Jung Hoon Choi
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Patent number: D1006191Type: GrantFiled: September 23, 2021Date of Patent: November 28, 2023Assignee: ESSEN TECH CO., LTD.Inventors: Sung Bum Kim, Ha Yeong Seong, Jung Hoon Choi
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Patent number: RE50160Abstract: A wireless power receiver is disclosed. A wireless power receiver according to various embodiments of the present disclosure includes a resonant reception unit configured to receive wireless power by a resonance scheme; an inductive reception unit configured to receive wireless power by an induction scheme; and a power processing unit configured to process wireless power received at the resonant reception unit and the inductive reception unit. When the wireless power is received by the induction scheme, a current flowing in the inductive reception unit is greater than a current flowing in the resonant reception unit, and when the wireless power is received by the resonance scheme, a current flowing in the resonant reception unit is greater than a current flowing in the inductive reception unit.Type: GrantFiled: September 9, 2020Date of Patent: October 1, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung-Bum Park, Do-Won Kim, Young-Ho Ryu, Dong-Zo Kim, Jae-Hyun Park, Keum-Su Song, Sung-Ku Yeo