Patents by Inventor Sungdan LEE

Sungdan LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12707216
    Abstract: Embodiments relate to a diaphragm having high rigidity and high internal loss. The diaphragm may comprise: a matrix-shaped structure including a plurality of through-holes; and a graphene layer disposed in at least a part of the plurality of through-holes and coupled to the structure.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 11, 2026
    Assignee: LG ELECTRONICS INC.
    Inventors: Sungdan Lee, Keunyoung Lee, Duho Lee
  • Publication number: 20240251214
    Abstract: Embodiments relate to a diaphragm having high rigidity and high internal loss. The diaphragm may comprise: a matrix-shaped structure including a plurality of through-holes; and a graphene layer disposed in at least a part of the plurality of through-holes and coupled to the structure.
    Type: Application
    Filed: May 13, 2021
    Publication date: July 25, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Sungdan LEE, Keunyoung LEE, Duho LEE