Abstract: Image sensors and fabrication methods thereof. For example, the image sensor may include a first substrate having a first surface and a second surface that are opposite to each other, a plurality of pixels provided in the first substrate and arranged in pixel groups, each pixel group including four pixels arranged in two columns and two rows, a pixel separation structure in the first substrate and including a pixel group separation part that separates each pixel group from adjacent pixel groups and a pixel separation part that separates the pixels in each pixel group from each other, and a plurality of microlenses on the first surface and respectively overlapping the plurality of pixel groups. Each of the microlenses includes a central part that has a first curvature and an edge part that has a second curvature. The first curvature is less than the second curvature.

Abstract: A semiconductor package includes: a first redistribution wiring layer having first redistribution wirings; a second redistribution wiring layer arranged on the first redistribution wiring layer, and including a first region, a second region, and a second redistribution wirings; a first semiconductor chip arranged on the first region of the second redistribution wiring layer; a plurality of second semiconductor chips spaced apart from each other on the upper surface of the second region of the second redistribution wiring layer; a plurality of third semiconductor chips arranged in the second region of the second redistribution wiring layer and spaced apart from each other between the first and second redistribution wiring layers; and a heat transfer medium arranged on the first region of the second redistribution wiring layer and overlapping the first semiconductor chip with the second redistribution wiring layer interposed between the first semiconductor chip and the heat transfer medium.

Abstract: A display device can include a first substrate having an active area and a non-active area, where the non-active area includes a plurality of first areas spaced apart from each other and a plurality of second areas disposed between the plurality of first areas. The display device can further include a plurality of first pad electrodes disposed on the plurality of first areas, a plurality of side lines disposed on the plurality of first pad electrodes, and a plurality of step compensation layers disposed in the plurality of second areas. By additionally forming the step compensation layers in the second areas, it is possible to compensate for step differences between the plurality of first areas and the plurality of second areas.

Abstract: Provided herein are T-cell receptors (TCRs) that when expressed recombinantly on the surface of a T cell are able to recognize the MAGE-B2-derived peptide GVYDGEEHSV (SEQ ID NO: 1) when presented by HLA-A*02:01 sufficiently to activate the recombinant T cell. Certain TCRs provided herein also are able to recognize the MAGE-A4-derived peptide GVYDGREHTV (SEQ ID NO:2) sufficiently to activate the recombinant T cell. Importantly, exemplary TCRs provided herein were thoroughly screened for lack of cross-reactivity with similar peptides that may be presented by normal cells or tissue and for alloreactivity.

Abstract: A semiconductor package comprising a package substrate that extends in a first direction and a second direction perpendicular to the first direction, a plurality of logic dies and a memory stack structure on the package substrate, and an interposer substrate mounted in the package substrate. The memory stack structure vertically overlaps the interposer substrate. Each of the logic dies includes a first part that is horizontally offset from the interposer substrate and a second part that vertically overlaps the interposer substrate. The interposer substrate includes an interlayer dielectric layer and a plurality of wiring lines in the interlayer dielectric layer. The memory stack structure is electrically connected to at least one of the logic dies through the wiring lines of the interposer substrate.

Abstract: A display apparatus includes: a substrate including pixel circuit areas, line areas arranged between the pixel circuit areas, and non-line areas which are arranged between the line areas and in which no line is arranged; a pixel circuit arranged in the pixel circuit areas and including at least one thin film transistor; a plurality of lines arranged in the pixel circuit areas and the line areas; and a display element including a pixel electrode connected to the pixel circuit, where in a plan view an area of the pixel electrode is greater than an area in which the pixel circuit is arranged.

Abstract: An electronic device and method are provided for obtaining an image. An electronic device may include cameras; a distance sensor including a light-emitting part and a light-receiving part; and a processor.

Abstract: An embodiment of the present disclosure provides a display device for adjusting recognition sensitivity of a speech recognition starting word, the display device including a display, a microphone, a memory configured to store a default starting word recognition engine that recognizes a speech recognition starting word, and a processor configured to determine a valid recognition threshold range of the default starting word recognition engine, assign recognition thresholds within the valid recognition threshold range to a predetermined number of sensitivity levels, display a sensitivity setting interface including the sensitivity levels through the display, and set a default recognition threshold of the default starting word recognition engine to a recognition threshold selected through the sensitivity setting interface.

Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer includes a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.

Abstract: A method for determining a vehicle get-on-and-off place includes receiving a first destination and a first origin along with a vehicle call request from a first user terminal, setting first candidate get-on places within a predetermined distance from the first origin and first candidate get-off places within a predetermined distance from the first destination, generating first get-on-and-off pairs by combination of first candidate get-on places and first candidate get-off places, determining a passenger moving time based on the first origin, the first destination, and each entire path, with respect to each in entire paths based on each in first get-on-and-off pairs, determining a vehicle running time based on each entire path, with respect to each in entire paths, and determining a total travel time based on an expected demand, the passenger moving time, and the vehicle running time with respect to each in entire paths.

Abstract: An electronic device is provided.

Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer in a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.

Abstract: A server for providing a passenger transportation service, may include a registered location database configured to store position information and image information related to each of previously registered get-on-and-off locations, a registered location management module configured to receive image data photographed from vehicles providing passenger transportation service during running and additional information including position information related to each of the image data, and update the image information based on the additional information by use of the image data, and a service providing module configured to, upon receiving a service provision request including position information and destination information related to a user from a user terminal, select a get-on location and a get-off location from among the get-on-and-off locations based on the position information and the destination information related to the user, and transmit get-on-and-off information including image data of the get-on location

Abstract: An electronic device is provided.

Abstract: A display apparatus including a housing; a display; a roller accommodated in the housing to rotate and roll or unroll the display; and a processor configured to in response to receiving a command to display content, control the roller to rotate and unroll the display from the housing so the display is drawn out and extended from the housing, and control the display to display an entire image of the content while simultaneously expanding a size of the entire image of the content as the display is being extended from the housing so a partial portion of the content is not blocked from being viewed as the display is drawn out and extended from the housing.

Abstract: An electronic device and method are provided for obtaining an image. An electronic device may include cameras; a distance sensor including a light-emitting part and a light-receiving part; and a processor.

Abstract: A method for operating a parking place based on demand expectation, may include expecting n quantity of calls corresponding to a current time in a service area, deriving Nc quantity of assignment combinations that assign Nb quantity of vehicles in standby in the service area with respect to Na quantity of parking places positioned in the service area, with respect to each in the Nc quantity of assignment combination, allocating the expected n quantity of calls to Nd quantity of vehicles in the service area including the Nb quantity of vehicles, and deriving Nd quantity of total travel times of the Nd quantity of vehicles, and assigning a corresponding parking place from among the Na quantity of parking places to each in the Nb quantity of vehicles based on the Nd quantity of total travel times with respect to each in the Nc quantity of assignment combination.

Abstract: An electronic device is provided.

Abstract: A semiconductor package comprising a package substrate that extends in a first direction and a second direction perpendicular to the first direction, a plurality of logic dies and a memory stack structure on the package substrate, and an interposer substrate mounted in the package substrate. The memory stack structure vertically overlaps the interposer substrate. Each of the logic dies includes a first part that is horizontally offset from the interposer substrate and a second part that vertically overlaps the interposer substrate. The interposer substrate includes an interlayer dielectric layer and a plurality of wiring lines in the interlayer dielectric layer. The memory stack structure is electrically connected to at least one of the logic dies through the wiring lines of the interposer substrate.

Abstract: A method for operating a parking place based on demand expectation, may include expecting n quantity of calls corresponding to a current time in a service area, deriving Nc quantity of assignment combinations that assign Nb quantity of vehicles in standby in the service area with respect to Na quantity of parking places positioned in the service area, with respect to each in the Nc quantity of assignment combination, allocating the expected n quantity of calls to Nd quantity of vehicles in the service area including the Nb quantity of vehicles, and deriving Nd quantity of total travel times of the Nd quantity of vehicles, and assigning a corresponding parking place from among the Na quantity of parking places to each in the Nb quantity of vehicles based on the Nd quantity of total travel times with respect to each in the Nc quantity of assignment combination.