Patents by Inventor Sunghee WON

Sunghee WON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode package
    Patent number: 9349923
    Abstract: Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: May 24, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sangwoo Lee, Sunghee Won
  • LIGHT-EMITTING DIODE PACKAGE
    Publication number: 20150243851
    Abstract: Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.
    Type: Application
    Filed: April 24, 2015
    Publication date: August 27, 2015
    Inventors: Sangwoo LEE, Sunghee WON
  • Light-emitting diode package
    Patent number: 9029877
    Abstract: Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: May 12, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sangwoo Lee, Sunghee Won
  • Light emitting device package and lighting system
    Patent number: 8492786
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a light emitting device disposed on a first lead frame, the light emitting device having an electrode pad on an upper surface thereof, a first wire to electrically interconnect a second lead frame spaced apart from the first lead frame and the electrode pad, and a first bonding ball disposed on the second lead frame, the first bonding ball spaced apart from a first contact point, which is in contact with the first wire and the second lead frame, wherein the first bonding ball is disposed between the first wire and the second lead frame to electrically interconnect the first wire and the second lead frame.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: July 23, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sunghee Won, Youngsu Chun
  • LIGHT-EMITTING DIODE PACKAGE
    Publication number: 20120313117
    Abstract: Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.
    Type: Application
    Filed: March 15, 2012
    Publication date: December 13, 2012
    Inventors: Sangwoo LEE, Sunghee Won
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
    Publication number: 20120305962
    Abstract: A light emitting device package is disclosed. The light emitting device package includes a light emitting device disposed on a first lead frame, the light emitting device having an electrode pad on an upper surface thereof, a first wire to electrically interconnect a second lead frame spaced apart from the first lead frame and the electrode pad, and a first bonding ball disposed on the second lead frame, the first bonding ball spaced apart from a first contact point, which is in contact with the first wire and the second lead frame, wherein the first bonding ball is disposed between the first wire and the second lead frame to electrically interconnect the first wire and the second lead frame.
    Type: Application
    Filed: March 5, 2012
    Publication date: December 6, 2012
    Inventors: Sunghee WON, Youngsu Chun