Abstract: The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler.

Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.

Abstract: An antenna structure may include a first radiation unit including a first radiator and a first transmission line that includes a first feeding portion directly connected to the first radiator and a first line portion connected to an end of the first feeding portion, a second radiation unit including a second radiator that has the same polarization direction as that of the first radiator, and a second transmission line that includes a second feeding portion directly connected to the second radiator and a second line portion connected to an end of the second feeding portion, and a third radiation unit including a third radiator that has the same polarization direction as that of the first radiator, and a third transmission line that includes a third feeding portion directly connected to the third radiator and a third line portion connected to an end of the third feeding portion.

Abstract: A circuit board for an antenna includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer, and a conductive layer disposed on the second surface of the core layer to cover the signal wiring in a plan view. The conductive layer has a slit portion formed around the signal wiring in the plan view.

Abstract: An antenna device according to an embodiments of the present invention includes a substrate layer, a ground layer disposed on a bottom surface of the substrate layer, a radiation control layer disposed on a top surface of the substrate layer, the radiation control layer including a plurality of radiation control patterns formed of a conductive mesh structure, each of the radiation control patterns having a hollow portion, an antenna dielectric layer disposed on the radiation control layer, and an antenna unit disposed on the antenna dielectric layer.

Abstract: An antenna package includes an antenna device including an antenna dielectric layer and an antenna unit formed on the antenna dielectric layer, and an intermediate circuit board electrically connected to the antenna unit. The intermediate circuit board includes a core layer and a signal line formed on a surface of the core layer and electrically connected to the antenna unit. A width of one end portion of the signal line connected to the antenna unit is smaller than a width of the other end portion opposite to the one end portion of the signal line. Impedance mismatching is prevented by the construction of the signal line to improve antenna properties.

Abstract: An impedance converter for an antenna includes a first port receiving a power from an antenna driving integrated circuit, an impedance modulator connected to the first port to convert an impedance, and a second port connected to the modulator and configured to perform a feeding to an antenna unit. The second port has an impedance higher than that of the first port. Impedance mismatching is prevented by the impedance modulator to improve antenna properties.

Abstract: A handler for testing semiconductor devices is provided, wherein a soaking plate is fitted on a handler body having temperature control means for heating and/or cooling semiconductor devices placed thereon. Loading/unloading shuttles are movably fitted, such that they can move in a forward/backward direction, for carrying the semiconductor deices to/from a test site, thereby simplifying a handler system and permitting accurate temperature testing under in high or low temperature environments.