Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.

Abstract: Disclosed are a buffer unit, in which a plurality of support plates is stacked in a vertical direction and a connection block is provided between the plurality of support plates to prevent vibration generated at the lower end of the support plate from being transmitted from the upper support plate, and a substrate treating apparatus. According to the present invention, it is possible to reduce the vibration generated in the buffer unit, so that there is an effect of improving the efficiency of the substrate treating process.

Abstract: Provided is a substrate processing apparatus capable of effectively removing contaminants in an edge region of a substrate. The substrate processing apparatus comprises: a support configured to rotate a substrate; a first bath installed around the support and configured to store a cleaning liquid and form a first opening on an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid, wherein the substrate is not immersed in the first bath, and the edge region of the substrate is cleaned by the protruding first water film while rotating the substrate by the support.

Abstract: Disclosed is a substrate treating apparatus for treating a substrate, the substrate treating apparatus including: a cup for providing a treatment space; a support unit provided to support a substrate in the treatment space; a cleaning solution supply unit for supplying a cleaning solution to the substrate supported on the support unit; and a controller for controlling the support unit and the cleaning solution supply unit, in which the cleaning solution supply unit includes: a support arm; a discharge head provided with a plurality of nozzles having outlets of different sizes; a rotating unit for rotating the discharge head; and a moving unit for moving the discharge head between a center region of the substrate and an edge region of the substrate, and the controller causes the cleaning solution to be discharged while moving the discharge head between a center region of the substrate and an edge region of the substrate, and rotates the rotating unit such that, upon movement of the discharge head, nozzles havi

Abstract: A method of treating a substrate treats a substrate by using a substrate treating apparatus that includes a main supply line connected to a humidified gas supply line and a dry gas supply line, having a first region in which a first heater is installed, and a second region located downstream of the first region. The method includes a heating operation of heating the second region with the dry gas heated in the first region by supplying the dry gas into the main supply line in a state where the first heater is controlled to heat the first region; and a substrate treating operation of supplying the humidified gas into the main supply line after the heating operation and allowing the humidified gas to pass through the first region and the second region and to be supplied into the treatment space to treat the substrate disposed in the treatment space.

Abstract: Disclosed is a substrate processing method including: a substrate loading operation of loading a substrate into a processing space provided by a body; a heating operation of placing the substrate, which has been loaded into the processing space, on a heating chuck and heating the substrate; and an atmosphere changing operation of changing an atmosphere of the processing space, in which the atmosphere changing operation includes: a gas discharging operation of injecting atmosphere changing gas in a state where the substrate is located closer to a baffle than in the heating operation, in which the baffle is provided on a top side of the heating chuck to face the heating chuck and injects the atmosphere changing gas; and a substrate lowering operation of lowering and placing the substrate onto the heating chuck while maintaining the injection of the atmosphere changing gas.

Abstract: Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.

Abstract: Disclosed are a substrate processing apparatus and method in which in a heat-treatment process such as a baking process, a surrounding humidity environment may be precisely controlled based on photoresist for extreme ultraviolet (EUV) applied on the substrate. The substrate processing apparatus includes a housing having a treatment space defined therein; a support unit for supporting, thereon, a substrate received in the treatment space; and a gas supply unit configured to alternately supply a first gas and a second gas into the treatment space in response to photoresist (PR) for extreme ultraviolet (EUV) applied onto the substrate.

Abstract: A substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

Abstract: The present disclosure is to provide a piston assembly in which a particle does not leak out of a cylinder, and including, in an embodiment, a piston body; a piston rod connected to the piston body; a first groove formed in an outer surface of the piston body; and a particle discharge flow path extending from an internal space of the piston body to the outer surface of the piston body.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.

Abstract: The present disclosure is to provide a piston assembly in which a particle does not leak out of a cylinder, and including, in an embodiment, a piston body; a piston rod connected to the piston body; a first groove formed in an outer surface of the piston body; and a particle discharge flow path extending from an internal space of the piston body to the outer surface of the piston body.

Abstract: Provided is a substrate processing apparatus capable of effectively removing contaminants in an edge region of a substrate. The substrate processing apparatus comprises: a support configured to rotate a substrate; a first bath installed around the support and configured to store a cleaning liquid and form a first opening on an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid, wherein the substrate is not immersed in the first bath, and the edge region of the substrate is cleaned by the protruding first water film while rotating the substrate by the support.

Abstract: A substrate processing apparatus, which may suppress occurrence of temperature deviation caused by an air current, is provided. The substrate processing apparatus includes a chamber including an upper body and a lower body and having a processing space formed therein by the upper body and the lower body, a substrate support unit disposed in the processing space and having a support surface on which the substrate is supported, a heater disposed to heat gas in the processing space, an introduction unit configured to supply gas toward an edge of the support surface, and a discharge unit configured to discharge the gas in the processing space. The discharge unit may include a plurality of outlets spaced apart from a centerline of the support surface in the upper body and disposed to be closer to the centerline of the support surface than to the introduction unit.

Abstract: A substrate processing apparatus includes a substrate support unit, supporting a substrate, and an ultrasonic cleaning module disposed in a location lower than an upper surface of the substrate support unit. The ultrasonic cleaning module may include a receiving portion receiving a chemical, an opening portion in which at least a portion of an upper surface of the receiving portion is opened, and an ultrasonic vibration unit disposed to be directed toward the opening portion from the receiving portion, and may be configured in such a manner that a liquid surface of the chemical, rising by the ultrasonic vibration unit, touches the substrate through the opening portion.

Abstract: Disclosed are a buffer unit, in which a plurality of support plates is stacked in a vertical direction and a connection block is provided between the plurality of support plates to prevent vibration generated at the lower end of the support plate from being transmitted from the upper support plate, and a substrate treating apparatus. According to the present invention, it is possible to reduce the vibration generated in the buffer unit, so that there is an effect of improving the efficiency of the substrate treating process.

Abstract: Disclosed is a cutter apparatus for a double tube for cutting an outer tube in a double pipe including an inner tube and the outer tube, the cutter apparatus for the double tube including: a main body which is grippable by a hand of an operator; a cylindrical protection member which is connected to the main body and into which the inner tube is inserted; and a cutter member including a blade for cutting the outer tube.

Abstract: Provided is a substrate treatment apparatus with improved workability. The substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

Abstract: The present disclosure relates to a method for producing graphite oxide and an apparatus therefor.

Abstract: The present disclosure relates to a method for producing graphite oxide and an apparatus therefor.