Abstract: A chain guide that contacts a chain connecting a cam sprocket and a crank sprocket, and has a contact portion contacting the back of the chain in a length direction of the chain and a convex curved line in a cross-section of the contact portion.

Abstract: The present invention relates to a method for optimizing power/ground pads in a power/ground distribution network. A power/ground distribution network is created for each of multiple voltage domains and a load current source of each node of the power/ground distribution network is modeled in consideration of the actual shapes and areas of functional blocks. A local optimization method is developed to solve problems generated when a conventional optimization method is applied to optimization of power/ground pads in a bump shape used for a flip chip, and a combination of global optimization and local optimization is applied to layouts using bump bonding, which is discriminated from the conventional optimization method restrictively applicable to layouts using wire bonding.

Abstract: Friction reducing units are integrally configured in a tensioner arm and a chain guide that are disposed at both sides of a timing chain to make contact with the timing chain, respectively to increase the thickness of the oil film, such that it is possible to improve durability of an entire timing chain system while preventing noise from being generated by reducing a friction loss generated on each of contact surfaces of the tensioner arm and the chain guide and prevent fuel efficiency of the vehicle from being deteriorated.

Abstract: A chain guide that contacts a chain connecting a cam sprocket and a crank sprocket, and has a contact portion contacting the back of the chain in a length direction of the chain and a convex curved line in a cross-section of the contact portion.

Abstract: The present invention relates to a method for optimizing power/ground pads in a power/ground distribution network. A power/ground distribution network is created for each of multiple voltage domains and a load current source of each node of the power/ground distribution network is modeled in consideration of the actual shapes and areas of functional blocks. A local optimization method is developed to solve problems generated when a conventional optimization method is applied to optimization of power/ground pads in a bump shape used for a flip chip, and a combination of global optimization and local optimization is applied to layouts using bump bonding, which is discriminated from the conventional optimization method restrictively applicable to layouts using wire bonding.

Abstract: The present invention relates to a method for designing initial placement of functional blocks and designing power distribution network of a semiconductor integrated circuit in the next stage of architecture level design of integrated circuit, which estimates the area and the quantity of power consumption of functional blocks and integrated circuit using design specifications of the functional blocks constructing the integrated circuit, that is, interconnection between functional blocks and an estimated size of the functional blocks which is determined in an architecture level design process. The present invention enables initial functional block placement in consideration of power consumption of the functional blocks and analyze reliability of power distribution network even prior to detailed circuit design.