Patents by Inventor Sung Jin Ahn

Sung Jin Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250190346
    Abstract: Proposed is a method for generating training data for training an artificial intelligence model capable of automatically designing a cache memory structure. The method for generating training data for cache memory design includes setting a reuse profile, setting a first selection reuse distance based on the reuse profile, setting a first load index and a first real reuse distance based on the first selection reuse distance, modifying the reuse profile according to setting the first real reuse distance, and setting a second selection reuse distance based on the modified reuse profile.
    Type: Application
    Filed: December 3, 2024
    Publication date: June 12, 2025
    Inventors: Eui-Young Chung, Do Hyeon KIM, Min Jung Cho, Sang Hyup Lee, Seong Jae Eom, Sung Jin Ahn
  • Patent number: 11482653
    Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 25, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kuk Lee, Dae Young Lee, Moon Sub Kim, Sung Jin Ahn, Seung Hwan Lee, Dong Kyun Yim, Woo Seok Jang
  • Publication number: 20190371988
    Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.
    Type: Application
    Filed: January 31, 2019
    Publication date: December 5, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kuk LEE, Dae Young LEE, Moon Sub KIM, Sung Jin AHN, Seung Hwan LEE, Dong Kyun YIM, Woo Seok JANG
  • Patent number: 10361351
    Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Hoon Kwak, Sung Jin Ahn, Hak Hwan Kim, Jin Hwan Kim, Jin Kweon Chung, Min Jung Kim
  • Publication number: 20190067539
    Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.
    Type: Application
    Filed: March 15, 2018
    Publication date: February 28, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: CHANG HOON KWAK, SUNG JIN AHN, HAK HWAN KIM, JIN HWAN KIM, JIN KWEON CHUNG, MIN JUNG KIM
  • Publication number: 20170260653
    Abstract: Provided is an eco-friendly filament using a biomass manufactured by extruding a bioplastic pellet which is formed from a bioplastic pellet composition including mixed particles including a coffee byproduct with a fatty acid content of 0.01 to 2.5 wt % or less and inorganic particles and having a size of 50 ?m or less; an additive; and a plastic raw material. The inorganic particles are one or more selected from the group consisting of calcium carbonate, silica, starch, alumina, titanium dioxide, talc, kaolin, mica, sericite, zinc oxide, barium carbonate, barium sulfate, diatomaceous earth, magnesium carbonate, magnesium silicate, boron nitride, alumina, zirconium oxide, iron oxide and mica titanium. The additive is one or more selected from the group consisting of an amide-based active compound, copolyamide, ethyl methane sulfonate (EMS), ethylene bis stearamide (EBS), and D-sorbitol.
    Type: Application
    Filed: January 11, 2017
    Publication date: September 14, 2017
    Inventor: Sung Jin Ahn
  • Patent number: D563443
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: March 4, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung Jin Ahn, Yeon Taek Oh, Ki Cheol Park, Yong Jae Kim, Won Jun Koh, Sung Ha Kim
  • Patent number: D729769
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: May 19, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaewook Yoo, Bongkun Shin, Sung Jin Ahn
  • Patent number: D729770
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: May 19, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaewook Yoo, Bongkun Shin, Sung Jin Ahn