Abstract: A camera module disclosed in the embodiment of the invention includes a substrate; an image sensor disposed on the substrate; a lens assembly disposed on the image sensor and including a barrel portion having a plurality of lenses in a through hole; an optical filter disposed between the image sensor and a last lens; a housing disposed between an upper surface of the substrate and an outer circumference of the lens assembly; and an adhesive member that adheres the housing to the outer circumference of the lens assembly, wherein a package having the image sensor, the lens assembly, the housing, and the adhesive member have different thermal expansion coefficients from each other, an optical axis distance between a lens closest to the image sensor among the lenses with the lens assembly and the image sensor is BFL (Back focusing length), and a height from a lower surface of the lens assembly to an upper surface of the adhesive member may be greater than the BFL and 3 mm or less.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber in which a process with respect to a substrate is performed, a susceptor which is installed in the chamber and on which the substrate is placed, a plurality of lift pins passing through the susceptor to support the substrate, and a plurality of protection plugs protruding from a bottom surface of the susceptor to surround a portion of each of the lift pins protruding from the bottom surface of the susceptor.

Abstract: A method for tile-based rendering may include verifying a size of a memory available in an apparatus for rendering, and determining a number of buffers required for performing a rendering based on graphics data input, and may further include determining a size of a tile to be used for performing the rendering based on the determined number of buffers and the size of the memory available.

Abstract: A method and apparatus for configuring dynamic data are provided. A compilation apparatus may select a data format showing an optimum performance when a binary code is executed, from among a plurality of data formats supported by an execution apparatus used to execute a binary code, and may generate a binary code that uses the selected data format. The execution apparatus may execute a binary code provided by the compilation apparatus.

Abstract: A method and apparatus for graphic processing using multi-threading includes at least one context task, mediation task, and control task executed by a processor. The at least one context task sequentially generates graphic commands. The mediation task mediates processing of the graphic commands. The mediation task may process a particular graphic command on behalf of the at least one context task, and change a processing order of the graphic commands. The control task transmits the graphic commands to a graphic hardware.

Abstract: Provided is a graphics processing method and apparatus using a post fragment shader. A rendering pipeline of the graphics processing apparatus may include a fragment shader that operates before a raster operator, and a post fragment shader that operates after the raster operator. Each of the fragment shader and the post fragment shader may apply a different effect to each of a plurality of fragments.

Abstract: Provided is an image processing apparatus. Ray tracing may be performed using a general scheme with respect to a plurality of reference pixels among pixels of an image to be rendered. With respect to a pixel excluding the reference pixels, geometry information may be interpolated based on a ray tracing result of adjacent reference pixels.

Abstract: A method and apparatus for processing a vertex may fetch pieces of position information of vertexes, may extract pieces of target position information from the fetched pieces of position information, may perform tile binning on the pieces of target position information, may fetch pieces of attribute information having same indexes as the pieces of target position information, and may shade the fetched pieces of attribute information.

Abstract: Provided are a light emitting device, a method of fabricating the light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first conductive type semiconductor layer, a light emitting layer over the first conductive type semiconductor layer, an electron blocking layer over the light emitting layer, and a second conductive type semiconductor layer over the electron blocking layer. The electron blocking layer comprises a pattern having a height difference.

Abstract: A method for tile-based rendering may include verifying a size of a memory available in an apparatus for rendering, and determining a number of buffers required for performing a rendering based on graphics data input, and may further include determining a size of a tile to be used for performing the rendering based on the determined number of buffers and the size of the memory available.

Abstract: A method and apparatus for configuring dynamic data are provided. A compilation apparatus may select a data format showing an optimum performance when a binary code is executed, from among a plurality of data formats supported by an execution apparatus used to execute a binary code, and may generate a binary code that uses the selected data format. The execution apparatus may execute a binary code provided by the compilation apparatus.

Abstract: A method to discard pixels early includes a first early depth test maintaining a depth value on a pixel to be discarded by a discard instruction, and a second early depth test updating the depth value on a pixel not to be discarded by the discard instruction. Because of the first and second early depth tests, a number of pixels to be processed by a pixel shading process may be reduced.

Abstract: Provided is a graphics processing method and apparatus using a post fragment shader. A rendering pipeline of the graphics processing apparatus may include a fragment shader that operates before a raster operator, and a post fragment shader that operates after the raster operator. Each of the fragment shader and the post fragment shader may apply a different effect to each of a plurality of fragments.

Abstract: Provided are a light emitting device, a method of fabricating the light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first conductive type semiconductor layer, a light emitting layer over the first conductive type semiconductor layer, an electron blocking layer over the light emitting layer, and a second conductive type semiconductor layer over the electron blocking layer. The electron blocking layer comprises a pattern having a height difference.

Abstract: Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.

Abstract: A light emitting device according to an embodiment of the present invention includes a first conductive semiconductor layer providing a roughness on a upper surface thereof and including a PEC etching control layer; an active layer under the first conductive semiconductor layer; a second conductive semiconductor layer under the active layer; a reflective electrode electrically connected to the second conductive semiconductor layer; and a first electrode electrically connected to the first conductive semiconductor layer.

Abstract: A method and apparatus for processing a vertex may fetch pieces of position information of vertexes, may extract pieces of target position information from the fetched pieces of position information, may perform tile binning on the pieces of target position information, may fetch pieces of attribute information having same indexes as the pieces of target position information, and may shade the fetched pieces of attribute information.

Abstract: A method to discard pixels early includes a first early depth test maintaining a depth value on a pixel to be discarded by a discard instruction, and a second early depth test updating the depth value on a pixel not to be discarded by the discard instruction. Because of the first and second early depth tests, a number of pixels to be processed by a pixel shading process may be reduced.

Abstract: Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.