Patents by Inventor SungJin YUN

SungJin YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, and printed circuit board using same
    Patent number: 9504147
    Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: November 22, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yeo Eun Yoon, Myeong Jeong Kim, Sungjin Yun, Sanga Ju
  • Epoxy resin composition, and printed circuit board using same
    Patent number: 9468096
    Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: October 11, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sungjin Yun, Jae Man Park, Jong Heum Yoon, Young Ju Han
  • Epoxy resin composition and printed circuit board using same
    Patent number: 9445500
    Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 13, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Myeong Jeong Kim, Jae Man Park, Jeungook Park, Sungjin Yun, Jong Heum Yoon
  • Epoxy resin composition, and printed circuit board using same
    Patent number: 9445499
    Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 13, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jong Heum Yoon, Myeong Jeong Kim, Jeungook Park, Sungjin Yun
  • EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING SAME
    Publication number: 20150334827
    Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).
    Type: Application
    Filed: December 6, 2013
    Publication date: November 19, 2015
    Inventors: Myeong Jeong KIM, Jae Man PARK, Jeungook PARK, Sungjin YUN, Jong Heum YOON
  • RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
    Publication number: 20150319855
    Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.
    Type: Application
    Filed: December 6, 2013
    Publication date: November 5, 2015
    Inventors: Yeo Eun YOON, Myeong Jeong KIM, Sungjin YUN, Sanga JU
  • EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
    Publication number: 20150319857
    Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).
    Type: Application
    Filed: December 6, 2013
    Publication date: November 5, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jong Heum YOON, Myeong Jeong KIM, Jeungook PARK, Sungjin YUN
  • EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
    Publication number: 20150319856
    Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).
    Type: Application
    Filed: December 6, 2013
    Publication date: November 5, 2015
    Inventors: Sungjin YUN, Jea Man PARK, Jong Heum YOON, Young Ju HAN
  • Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
    Patent number: 9000071
    Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: April 7, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jae Man Park, Hae Yeon Kim, SungBae Moon, Jeungook Park, SungJin Yun, JongHeum Yoon, Hyuk Soo Lee, Jaehun Jeong, In Hee Cho
  • EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND
    Publication number: 20130284502
    Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 31, 2013
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jae Man PARK, Hae Yeon KIM, SungBae MOON, Jeungook PARK, SungJin YUN, JongHeum YOON, Hyuk Soo LEE, Jaehun JEONG, In Hee CHO