Patents by Inventor Sungkun Hwang

Sungkun Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER BAKING APPARATUS
    Publication number: 20230187236
    Abstract: A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.
    Type: Application
    Filed: August 16, 2022
    Publication date: June 15, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonguk Seo, Seok Heo, Sungwook Kang, Byeongsang Kim, Sungkun Hwang, Igor Ivanov