Abstract: A lithography track system includes a plurality of process modules each configured to perform a photolithography process on a wafer, a transfer module configured to transfer the wafer between the plurality of process modules, a scanner at one end of the transfer module and configured to expose a photoresist material on the wafer, and a first interface box sharing the transfer module and configured to transfer the wafer to the scanner and to match vacuum degrees of the transfer module and the scanner.

Abstract: A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.