Abstract: Disclosed are a maximum power point tracker, a power conversion controller, a power conversion device having an insulating structure, and a method for tracking maximum power point. The power conversion device includes: a DC/AC converter including a primary DC chopper unit having a primary switch, a transformer, and an AC/AC conversion unit including a secondary switch; a current detector detecting current from an input stage of the DC/AC converter and providing a detected current value; a voltage detector detecting a system voltage from an output stage of the DC/AC converter; and a power conversion controller generating a primary PWM signal to be provided to the primary DC chopper unit and secondary first and second PWM signals, having the mutually opposing phases, to be provided to the AC/AC conversion unit by using the detected current value and the system voltage.

Abstract: The present invention relates to a method and an apparatus of bi-prediction coding, a method and an apparatus of bi-prediction decoding and a recording medium. In accordance with the present invention, there is provided a method and an apparatus of bi-prediction coding, a method and an apparatus of bi-prediction decoding and a recording medium capable of solving a problem of complexity in implementing the bi-prediction coding of image compression and improving the coding efficiency by more efficiently transmitting a motion vector based on a fact that the movement is linearly generated.

Abstract: The present invention relates to a solder resist composition including: 1 to 10 parts by weight of a triazene curing agent; 1 to 10 parts by weight of a curing accelerator; and 10 to 50 parts by weight of a diluent, with respect to 100 parts by weight of an epoxy base, a board for a package comprising a solder resist opening using the same, and a method for preparing the board for a package. According to the present invention, it is possible to form a small solder resist opening of less than about 50 ?m through laser ablation and improve laser processability of the thermosetting solder resist composition.