Patents by Inventor Sung-Lak Choi

Sung-Lak Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10222667
    Abstract: A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: March 5, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seong-Yong Hwang, An-Na Park, Weon-Sik Oh, Jin-Kwan Kim, Sung-Lak Choi, Kyung-Lae Rho, Hyo-Hwi Choi, Ju-Yong Kim, Dong-Ha Lee
  • Publication number: 20140014981
    Abstract: A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.
    Type: Application
    Filed: September 13, 2013
    Publication date: January 16, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventors: Seong-Yong Hwang, An-Na PARK, Weon-Sik OH, Jin-Kwan KIM, Sung-Lak CHOI, Kyung-Lae RHO, Hyo-Hwi CHOI, Ju-Yong KIM, Dong-Ha LEE
  • Patent number: 8035292
    Abstract: A planar light source device includes a lower substrate, a cathode electrode a carbon nanotube, an upper substrate, a fluorescent layer, and an anode electrode. The cathode electrode is on the lower substrate. The carbon nanotube is electrically connected to the cathode electrode. The upper substrate faces the lower substrate. The fluorescent layer and the anode electrode are formed on the upper substrate. Therefore, the planar light source device generates light without using mercury.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: October 11, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeong-Suk Yoo, Seung-Ki Joo, Myong-Hi Rhee, In-Sun Hwang, Hae-Il Park, Sung-Lak Choi
  • Publication number: 20100328582
    Abstract: A planar light source device includes a lower substrate, a cathode electrode a carbon nanotube, an upper substrate, a fluorescent layer, and an anode electrode. The cathode electrode is on the lower substrate. The carbon nanotube is electrically connected to the cathode electrode. The upper substrate faces the lower substrate. The fluorescent layer and the anode electrode are formed on the upper substrate. Therefore, the planar light source device generates light without using mercury.
    Type: Application
    Filed: September 14, 2010
    Publication date: December 30, 2010
    Inventors: Hyeong-Suk YOO, Seung-Ki Joo, Myong-Hi Rhee, In-Sun Hwang, Hae-II Park, Sung-Lak Choi
  • Patent number: 7816851
    Abstract: A planar light source device includes a lower substrate, a cathode electrode a carbon nanotube, an upper substrate, a fluorescent layer, and an anode electrode. The cathode electrode is on the lower substrate. The carbon nanotube is electrically connected to the cathode electrode. The upper substrate faces the lower substrate. The fluorescent layer and the anode electrode are formed on the upper substrate. Therefore, the planar light source device generates light without using mercury.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: October 19, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeong-Suk Yoo, Seung-Ki Joo, Myong-Hi Rhee, In-Sun Hwang, Hae-Il Park, Sung-Lak Choi
  • Patent number: 7528486
    Abstract: In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per cubic millimeter (mm3) is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 ?m. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: May 5, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-Yong Hwang, Weon-Sik Oh, Ju-Young Yoon, Sung-Lak Choi, Chun-Ho Song
  • Publication number: 20090090942
    Abstract: A wiring structure includes a substrate, a copper oxide layer having 16˜39 at % oxygen on the substrate and a copper layer on the copper oxide layer. The copper oxide layer has a thickness of 10-1000 ? and the copper layer has a thickness of 300-8000 ?. The copper layer and the copper oxide layer further have an alloy element less than 10 wt % and the alloy element is selected from the group of Ag, Ni, Mg, Zr, N.
    Type: Application
    Filed: September 4, 2008
    Publication date: April 9, 2009
    Inventors: Kyong-Sub Kim, Sang-Un Nam, Chang-Oh Jeong, Weon-Sik Oh, Sung-Lak Choi, Soo-Im Jeong, Jae-Ho Eo
  • Patent number: 7486284
    Abstract: A driver chip includes a base body, an input terminal section and a first output terminal section. The base body includes a face having a long side and a short side. The input terminal section is formed at a first edge portion of the face along the long side. The first output terminal section is formed at a second edge portion that is opposite to the first edge portion. The input terminal section and the first output terminal section are disposed within about 9d/10 from a center of the long side toward the short side, wherein ‘d’ represents a distance between the center of the long side and the short side.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: February 3, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-Yong Hwang, Weon-Sik Oh, Sung-Lak Choi, Chun-Ho Song, Ju-Young Yoon
  • Patent number: 7450393
    Abstract: A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: November 11, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-Yong Hwang, Weon-Sik Oh, Sung-Lak Choi, Chun-Ho Song, Ju-Young Yoon
  • Publication number: 20070040960
    Abstract: A planar light source device includes a lower substrate, a cathode electrode a carbon nanotube, an upper substrate, a fluorescent layer, and an anode electrode. The cathode electrode is on the lower substrate. The carbon nanotube is electrically connected to the cathode electrode. The upper substrate faces the lower substrate. The fluorescent layer and the anode electrode are formed on the upper substrate. Therefore, the planar light source device generates light without using mercury.
    Type: Application
    Filed: June 30, 2006
    Publication date: February 22, 2007
    Inventors: Hyeong-Suk Yoo, Seung-Ki Joo, Myong-Hi Rhee, In-Sun Hwang, Hae-Il Park, Sung-Lak Choi
  • Publication number: 20050285836
    Abstract: A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 29, 2005
    Inventors: Seong-Yong Hwang, An-Na Park, Weon-Sik Oh, Jin-Kwan Kim, Sung-Lak Choi, Kyung-Lae Rho, Hyo-Hwi Choi, Ju-Yong Kim, Dong-Ha Lee
  • Publication number: 20050195130
    Abstract: A driver chip includes a base body, an input terminal section and a first output terminal section. The base body includes a face having a long side and a short side. The input terminal section is formed at a first edge portion of the face along the long side. The first output terminal section is formed at a second edge portion that is opposite to the first edge portion. The input terminal section and the first output terminal section are disposed within about 9d/10 from a center of the long side toward the short side, wherein ‘d’ represents a distance between the center of the long side and the short side. The input and first output terminals formed on other region than an edge portion of a base body, on which stress is concentrated, enhance a reliability of electric connection between the driver chip and a display panel.
    Type: Application
    Filed: December 15, 2004
    Publication date: September 8, 2005
    Inventors: Seong-Yong Hwang, Weon-Sik Oh, Sung-Lak Choi, Chun-Ho Song, Ju-Young Yoon
  • Publication number: 20050173785
    Abstract: In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per m3 is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 ?m. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.
    Type: Application
    Filed: October 21, 2004
    Publication date: August 11, 2005
    Inventors: Seong-Yong Hwang, Weon-Sik Oh, Ju-Young Yoon, Sung-Lak Choi, Chun-Ho Song
  • Publication number: 20050157244
    Abstract: A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.
    Type: Application
    Filed: June 30, 2004
    Publication date: July 21, 2005
    Inventors: Seong-Yong Hwang, Weon-Sik Oh, Sung-Lak Choi, Chun-Ho Song, Ju-Young Yoon