Patents by Inventor Sungrak Hong

Sungrak Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10206300
    Abstract: A printed circuit board assembly includes a printed circuit board including a plurality of first conductive lines insulated from each other and an insulating layer disposed on the first conductive lines. The insulating layer having a recess disposed at a side surface of the insulating layer. The recess exposes the first conductive lines. The printed circuit board assembly further includes a flexible cable including a plurality of second conductive lines corresponding to the first conductive lines. The flexible cable is disposed in the recess.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: February 12, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sungrak Hong, Kyomin Kim, Dohyeon Park, Myoung-ha Jeon
  • Publication number: 20180020563
    Abstract: A printed circuit board assembly includes a printed circuit board including a plurality of first conductive lines insulated from each other and an insulating layer disposed on the first conductive lines. The insulating layer having a recess disposed at a side surface of the insulating layer. The recess exposes the first conductive lines. The printed circuit board assembly further includes a flexible cable including a plurality of second conductive lines corresponding to the first conductive lines. The flexible cable is disposed in the recess.
    Type: Application
    Filed: June 13, 2017
    Publication date: January 18, 2018
    Inventors: Sungrak Hong, Kyomin Kim, Dohyeon Park, Myoung-Ha Jeon