Patents by Inventor Sungshick Paik

Sungshick Paik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9556362
    Abstract: Provided herein is a resin-metal complex and a manufacturing method thereof, the resin-metal complex being a synthetic resin comprising an olefin resin, filler, and coupling agent combined with a metallic material, the filler being at least one of an organic filler and inorganic filler, the inorganic filler being wood flour, wood pellet, wood fiber, or paper powder, and the inorganic filler being talc, calcium carbonate, wollastonite, or kaolinite.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: January 31, 2017
    Assignee: WAPS. CO. LTD
    Inventors: Jae Choon Lee, Sungmin Park, Sungshick Paik
  • Publication number: 20140127435
    Abstract: Provided herein is a resin-metal complex and a manufacturing method thereof, the resin-metal complex being a synthetic resin comprising an olefin resin, filler, and coupling agent combined with a metallic material, the filler being at least one of an organic filler and inorganic filler, the inorganic filler being wood flour, wood pellet, wood fiber, or paper powder, and the inorganic filler being talc, calcium carbonate, wollastonite, or kaolinite.
    Type: Application
    Filed: July 18, 2013
    Publication date: May 8, 2014
    Applicant: WAPS. CO. LTD
    Inventors: Jae Choon Lee, Sungmin Park, Sungshick Paik