Patents by Inventor Sung Sig Kang

Sung Sig Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of operating a clamping system of a wire bonding machine
    Patent number: 8360304
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: January 29, 2013
    Assignee: Kulicke and Soffa Industries Inc.
    Inventors: Sung Sig Kang, Hing Kuong Wong, Samuel Capistrano, III, Abdul Shukor Mohd Salleh, Wun Man Oranna Yauw
  • Package structure and fabrication thereof
    Publication number: 20060216868
    Abstract: The fabrication and device of package structure with a plurality of conductive contacts are provided herein. At least one chip is attached among the conductive pads on the surface of a wafer. A number of conductive wires are attached on the conductive pads and encapsulated by a layer. The layer is removed from the top thereof until to expose the conductive contacts derived from the conductive wires.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 28, 2006
    Inventors: Jun-Young Yang, You-Ock Joo, Chang-Kyu Ahn, Jung-Tae Kim, Sung-Sig Kang