Patents by Inventor Sung-Sun Park

Sung-Sun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970493
    Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 30, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Sung-Ku Choi, Yoon-Suk Lee, Sung-Wook Kwon, Kyung-Sun Kim, Jeong-Geun Kim, Jeong-Ah Kim, An-Na Moon, Sun-Young Park, Jun-Su Ban, Dong-Keun Song, Kyu-Sic Jang, Ju-Young Jung, Soo-Jin Lee
  • Patent number: 11961867
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20240116882
    Abstract: The present invention relates to a novel benzotriazole derivative compound, a tautomer thereof, a pharmaceutically acceptable salt thereof, a hydrate thereof, or a stereoisomer thereof, which are related to a compound for inhibiting ENPP1, a composition for inhibiting ENPP1, and a method for inhibiting ENPP1.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: TXINNO BIOSCIENCE INC.
    Inventors: Chan Sun Park, Sung Joon Kim, Ali Imran, Yoo Jin Na, So Ra Paik, Jung Hwan Choi, Sun Woo Lee, Yong Yea Park, Ah Ran Yu, Sun Young Park
  • Publication number: 20240092913
    Abstract: The present disclosure relates to an isolated anti-FcRN antibody, which is an antibody binding to FcRN (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmunre diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 21, 2024
    Applicant: HANALL BIOPHARMA CO., LTD.
    Inventors: Sung Wuk KIM, Seung Kook PARK, Jae Kap JEONG, Hyea Kyung AHN, Min Sun KIM, Eun Sun KIM, Hae-Young YONG, Dongok SHIN, Yeon Jung SONG, Tae Hyoung YOO
  • Publication number: 20240079413
    Abstract: A complementary thin film transistor (TFT) includes a substrate and a first TFT and a second TFT disposed on the substrate, wherein a first conductive semiconductor layer of the first TFT and a second gate electrode layer of the second TFT are disposed in the same layer and include the same material.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 7, 2024
    Inventors: Himchan OH, Jong-Heon YANG, Ji Hun CHOI, Seung Youl KANG, Yong Hae KIM, Jeho NA, Jaehyun MOON, Chan Woo PARK, Sung Haeng CHO, Jae-Eun PI, Chi-Sun HWANG
  • Patent number: 11917651
    Abstract: Disclosed are various methods for transmitting or receiving data or control information having high reliability conditions. A method for operating a terminal which transmits uplink control information (UCI) includes: a step of generating UCI; a step of comparing the priority of an uplink (UL) control channel for the transmission of the UCI with the priority of a UL data channel when some symbols of the UL control channel and the UL data channel overlap; and a step of selecting the UL channel having a higher priority among the UL control channel and the UL data channel, and transmitting the UCI to a base station through the selected UL channel.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: February 27, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Cheul Soon Kim, Sung Hyun Moon, Seung Kwon Baek, Gi Yoon Park, Ok Sun Park, Jae Su Song
  • Patent number: 11912674
    Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: February 27, 2024
    Assignee: IL DONG PHARMACEUTICAL CO., LTD.
    Inventors: Jae-Hoon Kang, Hong-Sub Lee, Yoon-Suk Lee, Jin-Ah Jeong, Sung-Wook Kwon, Jeong-Guen Kim, Kyung-Sun Kim, Dong-Keun Song, Sun-Young Park, Kyeo-Jin Kim, Ji-Hye Choi, Hey-Min Hwang
  • Publication number: 20230009679
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: July 18, 2022
    Publication date: January 12, 2023
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 11393734
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: July 19, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20200219780
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: October 15, 2019
    Publication date: July 9, 2020
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 10446455
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: October 15, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 10297515
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 21, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20170243798
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: May 10, 2017
    Publication date: August 24, 2017
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20160335470
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: April 18, 2016
    Publication date: November 17, 2016
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 9362437
    Abstract: In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) module or package. In each embodiment of the present invention, the CPV module includes a mounting device or holder for use in maintaining an optical member or optical light guide of the module in a prescribed position relative to the solar cell or receiver die thereof.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: June 7, 2016
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ik Su Jun, Do Won Lee
  • Patent number: 9237212
    Abstract: A locking device for a sliding/swing type mobile terminal is provided. The terminal includes a body housing and a sliding housing which slides on the body housing and swinging to open and close. The locking device includes a sliding member connected to the sliding housing while enabling the sliding housing to slide, a swing member which assembles the sliding member while enabling the sliding member to swing, and a locking unit which includes the sliding member and the swing member, the locking unit which prevents the sliding housing from swinging while sliding and from sliding while swinging in a state before sliding.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: January 12, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Yup Lee, Sung-Sun Park
  • Patent number: 8698754
    Abstract: A keypad for an electronic device and manufacturing method thereof having at least one or more ink layers which selectively let pass or cut off a light wavelength of at least one or more light emitting diodes generating light in accordance with an opened or closed direction of a folder. At least one or more light emitting elements for generating light in various colors are provided, and a diffusion ink layer is arranged above the light emitting elements. At least one or more ink layers provided on the diffusion ink layer, wherein the ink layers selectively let passes or cut-off light wavelengths of the light emitting elements when the folder is rotated or slid in a longitudinal or perpendicular direction. A transparent or semi-transparent ink layer is provided on the ink layers, and a sheet film layer is provided on the transparent or semi-transparent ink layer.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: April 15, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-Suk Rhyu, Shin-Chul Kang, Sung-Sun Park, Jae-Chul Jin
  • Patent number: 8634548
    Abstract: A free-stop hinge apparatus employed in a folding-type mobile terminal preferably includes: a hinge housing; a driving part for providing a free-stop operation, which is received in the hinge housing. A hinge shaft restrains the driving part in the hinge housing, and the driving part includes a rotating driving actuating cam and a driven sliding cam slides according to rotation of the driving actuating cam. The driving actuating cam includes an inner cam formed on one surface of a body, and an outer cam confronting the inner cam, and the driven sliding cam includes an inner valley which is disposed to confront the inner cam and slides together with the inner cam, and an outer valley which is disposed to confront the outer cam and slides together with the outer cam.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: January 21, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Jun Jung, Hae-Won Sung, Sung-Sun Park
  • Patent number: 8362598
    Abstract: In accordance with the present invention, there is provided a quad flat no leads (QFN) semiconductor device or package including a leadframe wherein the leads of the leadframe are selectively formed so that portions one or more prescribed leads are exposed in a package body of the semiconductor package and electrically connected to an electromagnetic interference (EMI) shielding layer applied to the package body. In certain embodiments of the present invention, one or more tie bars of the leadframe may also be formed so as to be exposed in the package body of the semiconductor package and electrically connected to the shielding layer applied to the package body. Thus, in the present invention, the shielding layer may be electrically connected to one or more leads alone or in combination with one or more tie bars of the leadframe.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: January 29, 2013
    Inventors: Sung Sun Park, Ik Su Jun, Ye Sul Ahn
  • Patent number: 8229521
    Abstract: A head set device includes an antenna housing, a speaker housing connected to the antenna housing while protruding from one face of the antenna housing, and a hinge device for rotatably combining the speaker housing to the antenna housing. The speaker housing rotates with respect to a rotation axis that extends outwardly from one face of the antenna housing. The antenna housing and the speaker housing are rotatably connected together using a hinge device, thereby allowing the user to selectively wear the head set device on either ear and thus facilitating the use of the head set device.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: July 24, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo-Sung Kang, Sung-Sun Park, Young-Jun Jung, Yeong-Moo Ryu