Patents by Inventor Sungwon KWON

Sungwon KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250360204
    Abstract: The present invention relates to an adjuvant composition including a galactose polymer which is interconnected by ?-1,4 bonds. The adjuvant composition of the present invention is a novel immunoactive adjuvant including an immunoactive structure having a galactan repeating sugar structure that has not been previously identified, and it has different mechanisms of action and operating principles compared to existing adjuvants. The adjuvant composition of the present invention has a structure based on plant natural polysaccharides, and it has high economic feasibility due to the characteristics of the carbohydrate structure, is biodegradable and thus environmentally friendly, and has high chemical stability.
    Type: Application
    Filed: June 7, 2024
    Publication date: November 27, 2025
    Inventors: SungWon Kwon, GyuHwan Hyun, SeulJi Lee
  • Patent number: 10620529
    Abstract: Disclosed is a photomask. The photomask comprises a substrate, a reflective layer on the substrate, and an absorption structure on the reflective layer. The absorption structure comprises absorption patterns spaced apart from each other on the reflective layer. The absorption structure may include dummy holes in at least one of the absorption patterns. The dummy holes exhaust hydrogen from the absorption structure. The photomask may include a barrier layer on the absorption structure. The barrier layer may reduce the amount of hydrogen entering the absorption structure.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: April 14, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungwon Kwon, Yongkyu Kim, Jinsu Kim
  • Patent number: 10274820
    Abstract: A pellicle for lithography processes, including extreme ultraviolet (EUV) lithography may mitigate thermal accumulation in a membrane of the pellicle. The pellicle includes a membrane and at least one thermal buffer layer on at least one surface of the membrane. An emissivity of the thermal buffer layer may be greater than an emissivity of the membrane. A carbon content of the thermal buffer layer may be greater than a carbon content of the membrane. Multiple thermal buffer layers may be on separate surfaces of the membrane, and the thermal buffer layers may have different properties. A capping layer may be on at least one thermal buffer layer, and the capping layer may include a hydrogen resistant material. A thermal buffer layer may extend over some or all of a surface of the membrane. A thermal buffer layer may be between at least two membranes.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 30, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwanchul Jeon, Munja Kim, Sungwon Kwon, Byunggook Kim, Roman Chalykh, Yongseok Jung, Jaehyuck Choi
  • Patent number: 10224178
    Abstract: A method of adjusting a critical dimension of a reticle patterns in a reticle used to fabricate semiconductor devices can include determining respective values for a critical dimension of a plurality of reticle patterns in an image of the reticle and providing an atmospheric plasma to a first reticle pattern included in the plurality of reticle patterns, the first reticle pattern having a first value for the critical dimension that is different than a target value for the critical dimension. The atmospheric plasma may not be provided to second reticle patterns included in the plurality of reticle patterns, the second reticle patterns having a second value for the critical dimension that is about equal to the target value.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: March 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongseok Jung, Sungwon Kwon, Heebom Kim, Donggun Lee
  • Publication number: 20180203346
    Abstract: A pellicle for lithography processes, including extreme ultraviolet (EUV) lithography may mitigate thermal accumulation in a membrane of the pellicle. The pellicle includes a membrane and at least one thermal buffer layer on at least one surface of the membrane. An emissivity of the thermal buffer layer may be greater than an emissivity of the membrane. A carbon content of the thermal buffer layer may be greater than a carbon content of the membrane. Multiple thermal buffer layers may be on separate surfaces of the membrane, and the thermal buffer layers may have different properties. A capping layer may be on at least one thermal buffer layer, and the capping layer may include a hydrogen resistant material. A thermal buffer layer may extend over some or all of a surface of the membrane. A thermal buffer layer may be between at least two membranes.
    Type: Application
    Filed: March 13, 2018
    Publication date: July 19, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hwanchul JEON, Munja KIM, Sungwon KWON, Byunggook KIM, Roman CHALYKH, Yongseok JUNG, Jaehyuck CHOI
  • Patent number: 9952502
    Abstract: A pellicle for lithography processes, including extreme ultraviolet (EUV) lithography may mitigate thermal accumulation in a membrane of the pellicle. The pellicle includes a membrane and at least one thermal buffer layer on at least one surface of the membrane. An emissivity of the thermal buffer layer may be greater than an emissivity of the membrane. A carbon content of the thermal buffer layer may be greater than a carbon content of the membrane. Multiple thermal buffer layers may be on separate surfaces of the membrane, and the thermal buffer layers may have different properties. A capping layer may be on at least one thermal buffer layer, and the capping layer may include a hydrogen resistant material. A thermal buffer layer may extend over some or all of a surface of the membrane. A thermal buffer layer may be between at least two membranes.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: April 24, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hwanchul Jeon, Munja Kim, Sungwon Kwon, Byunggook Kim, Roman Chalykh, Yongseok Jung, Jaehyuck Choi
  • Publication number: 20180082820
    Abstract: A method of adjusting a critical dimension of a reticle patterns in a reticle used to fabricate semiconductor devices can include determining respective values for a critical dimension of a plurality of reticle patterns in an image of the reticle and providing an atmospheric plasma to a first reticle pattern included in the plurality of reticle patterns, the first reticle pattern having a first value for the critical dimension that is different than a target value for the critical dimension. The atmospheric plasma may not be provided to second reticle patterns included in the plurality of reticle patterns, the second reticle patterns having a second value for the critical dimension that is about equal to the target value.
    Type: Application
    Filed: May 19, 2017
    Publication date: March 22, 2018
    Inventors: Yongseok JUNG, Sungwon Kwon, Heebom Kim, Donggun Lee
  • Publication number: 20180067390
    Abstract: Disclosed is a photomask. The photomask comprises a substrate, a reflective layer on the substrate, and an absorption structure on the reflective layer. The absorption structure comprises absorption patterns spaced apart from each other on the reflective layer. The absorption structure may include dummy holes in at least one of the absorption patterns. The dummy holes exhaust hydrogen from the absorption structure. The photomask may include a barrier layer on the absorption structure. The barrier layer may reduce the amount of hydrogen entering the absorption structure.
    Type: Application
    Filed: May 23, 2017
    Publication date: March 8, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sungwon Kwon, Yongkyu Kim, Jinsu Kim
  • Publication number: 20160334698
    Abstract: A pellicle for lithography processes, including extreme ultraviolet (EUV) lithography may mitigate thermal accumulation in a membrane of the pellicle. The pellicle includes a membrane and at least one thermal buffer layer on at least one surface of the membrane. An emissivity of the thermal buffer layer may be greater than an emissivity of the membrane. A carbon content of the thermal buffer layer may be greater than a carbon content of the membrane. Multiple thermal buffer layers may be on separate surfaces of the membrane, and the thermal buffer layers may have different properties. A capping layer may be on at least one thermal buffer layer, and the capping layer may include a hydrogen resistant material. A thermal buffer layer may extend over some or all of a surface of the membrane. A thermal buffer layer may be between at least two membranes.
    Type: Application
    Filed: January 12, 2016
    Publication date: November 17, 2016
    Inventors: Hwanchul JEON, Munja KIM, Sungwon KWON, Byunggook KIM, Roman CHALYKH, Yongseok JUNG, Jaehyuck CHOI
  • Publication number: 20160172207
    Abstract: A method of manufacturing a pellicle membrane includes forming a silicon layer on a substrate, forming a mask pattern on the silicon layer, and performing a wet etching process on the silicon layer exposed by the mask pattern to form silicon patterns with an uneven structure. A contact area between the silicon patterns and the substrate may be larger than that between the silicon patterns and the mask pattern, and each of the silicon patterns may be formed in such a way that a side surface thereof has an ascending slope in a vertical direction oriented from the substrate toward the mask pattern and is a crystal plane of (111).
    Type: Application
    Filed: December 1, 2015
    Publication date: June 16, 2016
    Inventors: Sungwon KWON, Chalykh ROMAN