Abstract: A device for providing tourism information and a method thereof are proposed. The method of operating an electronic device configured to provide the tourism information about a cultural heritage includes obtaining user information, providing first tourism information corresponding to the user information from a pre-stored tourism database, and providing second tourism information on the basis of the user information, wherein the second tourism information is information related to the first tourism information.

Abstract: A device for providing tourism information and a method thereof are proposed. The method of operating an electronic device configured to provide the tourism information about a cultural heritage includes obtaining user information, providing first tourism information corresponding to the user information from a pre-stored tourism database, and providing second tourism information on the basis of the user information, wherein the second tourism information is information related to the first tourism information.

Abstract: A method and an analysis device thereof for analyzing a degree of correlation between an image generated by a generative model and a text prompt are proposed. The method includes receiving the text prompt by an analysis device, inputting the text prompt into the text-to-image generative model by the analysis device, calculating, by the analysis device, degrees of correlation between text elements in the text prompt and conditional latent vectors for each text element, and determining, by the analysis device, at least one text element among the text elements for generating the image if the degrees of correlation for the at least on text element is greater than a threshold value, wherein the conditional latent vectors are generated in a process of generating the image by the text-to-image generative model.

Abstract: An apparatus for identifying a warship receives a warship image, estimates a photographing angle and a photographing altitude of the warship from the real warship image, generates virtual warship images from stored virtual warship models based on the estimated photographing angle and photographing altitude, generates virtual warship part images in which main parts are classified and displayed for each of the virtual warship images, generates a part segmentation image in which main parts are classified and displayed for the real warship image, and outputs a type and class identification result of the warship by calculating similarity between each virtual warship part image and the part segmentation image.

Abstract: An apparatus for identifying a warship receives a warship image, estimates a photographing angle and a photographing altitude of the warship from the real warship image, generates virtual warship images from stored virtual warship models based on the estimated photographing angle and photographing altitude, generates virtual warship part images in which main parts are classified and displayed for each of the virtual warship images, generates a part segmentation image in which main parts are classified and displayed for the real warship image, and outputs a type and class identification result of the warship by calculating similarity between each virtual warship part image and the part segmentation image.

Abstract: Embodiments of a method for performing a thermal compression bonding process with a non-uniform temperature pattern and a heater having the non-uniform temperature pattern are disclosed. In some embodiments, the heater includes a plurality of heating element segments configured to generate the non-uniform temperature pattern. The configuration comprises a plurality of heating element segment densities or a plurality of heating element segment resistances.

Abstract: An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.

Abstract: An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.

Abstract: The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages with an underfill material dispenser. In at least one embodiment, an underfill material dispenser may include a heater having a plurality of conduits. Other embodiments of the present disclosure may further include multiple dispense needle configurations, angled dispense nozzle exit conduits, conical nozzle exit conduits, and satellite traps.

Abstract: The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages with an underfill material dispenser. In at least one embodiment, an underfill material dispenser may include a heater having a plurality of conduits. Other embodiments of the present disclosure may further include multiple dispense needle configurations, angled dispense nozzle exit conduits, conical nozzle exit conduits, and satellite traps.

Abstract: The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

Abstract: The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

Abstract: Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit (“IC”) dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit (“IC”) dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

Abstract: Disclosed are embodiments of a stacked die package including a thermally conductive block disposed in the substrate. The die stack may include a lower die thermally coupled with the conductive block and one or more upper die disposed on the lower die. The upper die may be electrically interconnected to one another and with the lower die by a number of thru-vias, and the die stack may also be electrically coupled with the substrate. Other embodiments are described and claimed.