Abstract: Provided is an operating method of a server that performs a life-cycle assessment on a battery.

Abstract: The power module for a vehicle is provided. The power module includes a first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer, a lead frame including a plurality of direct current (DC) electrodes arranged on a side of the first circuit board, a first switching unit electrically connected to the plurality of DC electrodes and disposed on the first circuit board, and a capacitor component mounted on the lead frame to be electrically connected between the plurality of DC current electrodes.

Abstract: A power module for a vehicle is provided. The power module includes a first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer, a lead frame including a plurality of direct current (DC) electrodes arranged on one side of the first circuit board, a first switching unit electrically connected to the plurality of DC electrodes and disposed on the first circuit board, and an embedded capacitor electrically connected between the plurality of DC electrodes. The embedded capacitor is disposed to overlap at least one of the first insulating layer and the first metal layer in a direction in which the first insulating layer and the first metal layer face each other.

Abstract: A power module is provided. The power module includes a substrate on which at least one chip is mounted, a power lead connected to the substrate to supply power to the chip or output power converted by the chip, a metal layer electrically connected to the chip and the power lead to form a current loop, and a molded portion surrounding at least a portion of an outer surface of the substrate, the power lead, and the metal layer so that the chip is embedded therein.

Abstract: A power module is provided. The power module includes a substrate provided with a chip mounted thereon, a molded portion provided to surround the substrate and the chip, a lead portion having one end electrically connected to the chip inside the molded portion and the other end exposed to an outside of the molded portion, and an insulating rib portion protruding from an outer surface of the molded portion on which the lead portion is provided.

Abstract: A power module is provided. The power module includes a substrate, a chip mounted on the substrate and having a signal pad, and a lead portion electrically connected to the chip. The lead portion includes a signal lead provided to be spaced apart from the substrate, and a connecting lead connecting the signal lead and the signal pad.

Abstract: The present disclosure relates to a mount for a hydrogen storage tank of a vehicle. The mount may include an insulator configured to insulate vibration of the hydrogen storage tank; and a plurality of stoppers. The plurality of stoppers may include a first stopper and a second stopper. The first stopper may include a first attachment surface supporting an upper surface of the insulator. The second stopper may include a second attachment surface supporting a lower surface of the insulator.

Abstract: A composition for forming artificial teeth, a method for producing artificial teeth, and artificial teeth produced using the technique are disclosed. The disclosed composition for forming artificial teeth includes 100 parts by weight of a first photocurable compound illustrated in Chemical Formula 1 below, 5 to 20 parts by weight of a second photocurable compound represented by Chemical Formula 2 below, 25 to 50 parts by weight of a third photocurable compound depicted by Chemical Formula 3 below, and 1 to 10 parts by weight of a fourth photocurable compound shown by Chemical Formula 4 below.

Abstract: In the present disclosure, a central substrate is additionally disposed between an upper and lower substrates, thereby simplifying a current loop of a module. In addition, by simplifying the current loop between the upper and lower substrates, the central substrate enhances current overlap effect. Further disclosed is a power module in which an insulating pattern and a via spacer to form the current loop are reduced in size, resulting in a reduction of the overall module size.

Abstract: The present invention relates to functional saccharides having specific crystallinity, a method for preparing thereof, and a functional sweetener comprising the crystalline saccharides.

Abstract: A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer electrically interconnecting a first metal layer of the upper substrate and a second metal layer of the lower substrate, a second spacer electrically interconnecting the first semiconductor chip and the first metal layer, and a first connection layer configured to form a current path, and a power lead.

Abstract: A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.

Abstract: The present invention pertains to a transparent orthodontic device and a method for its preparation. The transparent orthodontic device described herein includes a tooth-contacting portion. This tooth-contacting portion consists of a concave section that makes contact with the tooth and a convex section that does not make contact with the tooth, positioned opposite each other.

Abstract: Provided are a composition for forming a transparent orthodontic device, a method of preparing a transparent orthodontic device, and a transparent orthodontic device prepared by using the method. The composition includes 100 parts by weight of a first photocurable compound represented by Formula 1, 35 parts by weight to 75 parts by weight of a second photocurable compound represented by Formula 2, 15 parts by weight to 65 parts by weight of a third photocurable compound represented by Formula 3, 5 parts by weight to 40 parts by weight of a fourth photocurable compound represented by Formula 4, and 1 part by weight to 15 parts by weight of a fifth photocurable compound represented by Formula 5.

Abstract: A power module includes at least one semiconductor chip, at least one substrate that supports the at least one semiconductor chip, and a first lead. The first lead includes (i) an extended portion having a first end connected to the at least one substrate and a second end protruding outward away from the at least one substrate and (ii) a resistance portion disposed between the first end and the second end of the extended portion.

Abstract: A power module includes a first substrate including a plurality of layers that are stacked in a first direction and extend in a second direction crossing the first direction, a semiconductor chip connected to the first substrate in the first direction, and a first lead that extends in the first direction, the first lead having a first end electrically connected to the first substrate and a second end exposed to an outside of the power module.

Abstract: An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.

Abstract: Introduced is a power module including a first substrate and a second substrate, a semiconductor chip, and a via spacer electrically connecting the first substrate and the second substrate, wherein the via spacer includes a first portion electrically connected to the first substrate, a second portion electrically connected to the second substrate, and a resistor portion including a resistance value greater than resistance values of the first portion and the second portion and arranged between the first portion and the second portion.

Abstract: The present disclosure discloses a method for leaching copper using a pressure leaching technique, according to one embodiment, including: a raw material preparation step of preparing a raw material containing copper; and a pressure leaching step including a step of introducing the raw material into a leachate in a pressurization device and pressure-leaching copper while injecting oxygen into the pressurization device.

Abstract: The present invention relates to a method for preparing a crystalline functional sweetener, and more specifically, relates to a method for preparing a crystalline functional sweetener for raising the crystallization yield and increasing the particle size by controlling the content of impurities or production of impurities comprised in a solution for preparing the crystal.