Patents by Inventor Sung Young Kim

Sung Young Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11873339
    Abstract: The present disclosure relates generally to anti-C10orf54 antibodies, including antibody-drug conjugates comprising the antibodies, and methods of their use.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: January 16, 2024
    Assignee: PIERRE FABRE MEDICAMENT
    Inventors: John Lippincott, Edward Thein Htun Van Der Horst, Sung Young Kim, Leonard G Presta, Jan-Willem Theunissen
  • Publication number: 20230190976
    Abstract: A sterilization system that sterilizes an interior of a storage compartment of a vehicle, including: at least one lamp configured to irradiate ultraviolet light to the interior of the storage compartment, a sensor configured to detect an open or closed state of the storage compartment, and a controller configured to based on the storage compartment being switched from an open state to a closed state in a state where the sterilization system is turned on, turn on the at least one lamp, count a duration for which the at least one lamp is in an ON state, based on the counted duration reaching a preset duration, turn off the at least one lamp, and based on the storage compartment being switched to the open state in a state where the at least one lamp is turned on, turn off the at least one lamp.
    Type: Application
    Filed: September 13, 2022
    Publication date: June 22, 2023
    Inventors: Wansu Park, Tae Hoon LEE, Sang Hoon PARK, Sung Hwan KIM, Sang Ki LEE, Sung Young KIM
  • Publication number: 20200385473
    Abstract: The present disclosure relates generally to anti-C10orf54 antibodies, including antibody-drug conjugates comprising the antibodies, and methods of their use.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 10, 2020
    Inventors: John LIPPINCOTT, Edward Thein Htun VAN DER HORST, Sung Young KIM, Leonard G PRESTA, Jan-Willem THEUNISSEN
  • Patent number: 10766959
    Abstract: The present disclosure relates generally to anti-C10orf54 antibodies, including antibody-drug conjugates comprising the antibodies, and methods of their use.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: September 8, 2020
    Assignee: Pierre Fabre Medicament
    Inventors: John Lippincott, Edward Thein Htun Van Der Horst, Sung Young Kim, Leonard G Presta, Jan-Willem Theunissen
  • Publication number: 20190177415
    Abstract: The present disclosure relates generally to anti-C10orf54 antibodies, including antibody-drug conjugates comprising the antibodies, and methods of their use.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 13, 2019
    Inventors: John LIPPINCOTT, Edward Thein Htun VAN DER HORST, Sung Young KIM, Leonard G PRESTA, Jan-Willem THEUNISSEN
  • Patent number: 10227338
    Abstract: The invention relates to a compound represented by Chemical Formula 1, below, a pharmaceutically acceptable salt thereof, and a pharmaceutical composition comprising the compound or salt. The compound of the invention or pharmaceutically acceptable salts thereof can be used for the prevention or treatment of sodium channel blocker-related diseases.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: March 12, 2019
    Assignee: Daewoong Pharmaceutical Co., Ltd.
    Inventors: Hyung-Geun Lee, Il-Hwan Kim, Myunggi Jung, Hyo Shin Kim, Chun Ho Lee, Sun Ah Jun, Ji Sung Yoon, Sung-Young Kim
  • Publication number: 20180346459
    Abstract: The present invention relates to a compound represented by Chemical Formula, or a pharmaceutically acceptable salt thereof. The compound according to the present invention can be usefully used for the prevention or treatment of sodium channel blocker-related diseases.
    Type: Application
    Filed: November 11, 2016
    Publication date: December 6, 2018
    Inventors: Hyung-Geun LEE, Il-Hwan KIM, Myunggi JUNG, Hyo Shin KIM, Chun Ho LEE, Sun Ah JUN, Ji Sung YOON, Sung-Young KIM
  • Patent number: 8058558
    Abstract: A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: November 15, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jee-Soo Mok, Dong-Jin Park, Jun-Heyoung Park, Ki-Hwan Kim, Sung-Young Kim
  • Patent number: 7969255
    Abstract: A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating layer formed between the first and second layers. The PCB board further includes a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal, isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other, and a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal. The second signal line group corresponds to the isolation patterns.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: June 28, 2011
    Assignee: LG. Display Co. Ltd.
    Inventors: Sung Young Kim, Jin Woo Lee
  • Publication number: 20090267702
    Abstract: A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating layer formed between the first and second layers. The PCB board further includes a first signal line group disposed on the first layer while including a plurality of first signal lines each supplying a first signal, isolation patterns disposed on the first layer such that the isolation patterns are arranged between adjacent ones of the first signal lines, respectively, to prevent the adjacent first signal lines from interfering with each other, and a second signal line group disposed on the second layer while including a plurality of second signal lines each supplying a second signal different from the first signal. The second signal line group corresponds to the isolation patterns.
    Type: Application
    Filed: November 5, 2008
    Publication date: October 29, 2009
    Inventors: Sung Young Kim, Jin Woo Lee
  • Patent number: 7528566
    Abstract: Disclosed is a method for controlling a voltage of a DC link for an electric vehicle, which can reduce a capacitance of the DC link interposed between an inverter and a DC/DC converter. The method for controlling the voltage of the DC link in a power system of a vehicle including a battery, a DC/DC converter, the DC link, an inverter, a motor, and a control part controlling the DC/DC converter and the inverter includes the steps of installing a compensator in a control loop of the control part such that a DC link current of the DC/DC converter follows a DC link current of the inverter, calculating a predetermined compensation term based on information of the motor inputted into the compensator, and applying the compensation term to a voltage node in the control loop of the control part in the compensator.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: May 5, 2009
    Assignees: Hyundai Motor Company, Pohang University of Science & Technology
    Inventors: Hong Seok Song, Doo Yong Oh, Kwang Hee Nam, Sung Young Kim
  • Publication number: 20080181940
    Abstract: The present invention relates to a composition containing genistein that accelerates the expression of the Carnitine Palmitoyl Transferase-1 (CPT-1) for improving or treating obesity. More particularly, the composition of the present invention comprises genistein that accelerates the expression of the CPT-1, an important enzyme for the lipolysis of fatty acid, and comprises carnitine that transports fatty acid into mitochondria and accelerates oxidation of fat in the oxidation process of fatty acid.
    Type: Application
    Filed: March 7, 2008
    Publication date: July 31, 2008
    Applicant: Amorepacific Corporation
    Inventors: Hyun-woo PARK, Sung-Young Kim, Wan-Gi Kim, Su-Jong Kim, Ji-Hyun Kim, Tae-Ryong Lee, Young-Chul Sim, Sang-Jun Lee, Yoo Kim
  • Publication number: 20080115961
    Abstract: A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 22, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jee-Soo Mok, Dong-Jin Park, Jun-Heyoung Park, Ki-Hwan Kim, Sung-Young Kim