Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.

Abstract: The present invention relates to a composition for prevention or treatment of obesity or obesity-induced metabolic syndrome containing Enterococcus faecalis as an active ingredient. Specifically, it has been confirmed that Enterococcus faecalis EF-2001 exhibits the effect of inhibiting adipogenesis in adipocytes, and thus the Enterococcus faecalis, a culture solution thereof, or killed bacteria thereof can be greatly usefully used for the prevention, improvement and treatment of obesity that occurs through adipogenesis in adipocytes or obesity-induced metabolic syndrome disease.

Abstract: A battery pack mounted to a vehicle includes a plurality of battery modules, each having at least one battery cell; and at least one magnetic member provided to one side surface of facing battery modules among the plurality of battery modules to at least partially detachably fix the plurality of battery modules to each other.

Abstract: A band selection switch circuit for an amplifier with an impedance matching circuit includes a band selection switch and an impedance compensation circuit. The band selection switch includes a signal port switch configured to selectively connect to one of a common transmit port, transmit and receive (TxRx) ports, and receive ports, and an impedance port switch configured to selectively connect the common transmit port and one of the receive ports and an impedance port. The impedance compensation circuit includes an impedance element connected to the impedance port.

Abstract: A liquid container comprises an upper part having an open bottom, a lower part having an open top, the lower part detachably coupled to the upper part under the upper part, and a cap detachably coupled to the lower part over or under the lower part, the cap having a flange formed along a lower outer circumference thereof, wherein a container opening/closing means coupling the upper part with the lower part, the container opening/closing means including a first opening/closing means or a second opening/closing means, wherein the first opening/closing means includes a bendable part attached to a lower side portion of the upper part and an upper side portion of the lower part, and wherein the second opening/closing means includes a hinge structure configured to open or close the upper part and the lower part with respect to each other.

Abstract: According to an embodiment of the disclosure, a container with a pump dispenser may comprise an upper part shaped as a cylinder having an opening in a bottom thereof, having a pump formed on a top thereof, and having an upper female thread formed along an inner circumferential portion of a lower portion thereof, the pump having a discharge hose connected thereto, a lower part shaped as a cylinder having an opening in a top thereof, having an upper male thread along an upper portion thereof to be coupled with the upper female thread of the upper part, and having a stepped portion along under a lower portion thereof to allow a packing to rest thereon, the lower part having a curved bottom, and a cap detachably coupled to the lower portion or the upper portion of the lower part.

Abstract: A front end module, includes a circuit board; a plurality of electronic components positioned on the circuit board, the electronic components comprising an amplifier configured to amplify a wireless frequency signal, a duplexer and filter configured to filter the wireless frequency signal amplified by the amplifier, and a switch selectively connecting the duplexer and filter with the amplifier; and a heat sink embedded within the circuit board under the amplifier and connected to the amplifier.

Abstract: A diplexer may include a diplexer circuit unit including a first branch operating in a first frequency band and a second branch operating in a second frequency band, a static-electricity protection circuit unit connected to at least one of the first branch and the second branch in parallel so as to discharge static electricity flowing in the first or second branch toward an avoidance path, and a compensation circuit unit connected to at least one of the first branch and second branch so as to compensate for degradation caused by the static-electricity protection circuit unit.

Abstract: Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

Abstract: A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

Abstract: Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.

Abstract: A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead frames, wherein a groove is defined in the reflector, wherein the reflector comprises a plurality of walls surrounding the groove, and wherein at least two walls of the groove face each other, iii) an LED chip mounted in the groove and electrically connected to the lead frames and iv) a lens array contained in the groove.

Abstract: A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.

Abstract: Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

Abstract: A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

Abstract: A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (f) sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.