Abstract: The invention includes a reactive hot melt adhesive composition including an isocyanate functional prepolymer derived from a polyfunctional isocyanate having a functionality of about 2 or more and a polyol, an active hydrogen organofunctional silane, an active hydrogen non-silane capping agent and a thermoplastic polymer.

Abstract: The invention includes a reactive hot melt adhesive composition including an isocyanate functional prepolymer derived from a polyfunctional isocyanate having a functionality of about 2 or more and a polyol, an active hydrogen organofunctional silane, an active hydrogen non-silane capping agent and a thermoplastic polymer.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: A dampening structure includes a polymer layer having a first surface and a second surface. The first surface includes a plurality of micro-structures, wherein each of the micro-structures has a width of less than about 400 microns. An elastic modulus of the polymer layer is greater than about 0.1 MPa and less than about 5 GPa at 25° C. The polymer layer is non-tacky.

Abstract: The present invention is an optical bonding layer including an optical film and a liquid optically clear adhesive positioned adjacent the optical film. The optical film is one of an optically clear film adhesive, a stretch releasable optically clear contrast enhancement film and a stretch releasable carrier film. The optical bonding layer has a transmittance of at least about 75%.

Abstract: An optical assembly is provided that includes a display panel, a substantially transparent substrate and an adhesive composition. The adhesive composition includes the reaction product of a miscible blend that includes one or more (meth)acrylate monomer, one or more multifunctional (meth)acrylate oligomer and one or more free-radical generating photoinitiator. The one or more multifunctional (meth)acrylic oligomer includes an acrylic oligomer derived from (meth)acrylate monomers that is not substantially bonded to the adhesive composition after it has been cured by exposure to actinic radiation. Also provide is a method of making the optical assembly and a tape that includes a backing and the provided adhesive composition that has been cured.

Abstract: An optically clear adhesive layer includes a liquid optically clear adhesive having a viscosity of less than about 20 Pa·s at a shear rate of 1 sec?1 and a thixotrope. The optically clear adhesive layer has a haze of about 2% or less, a viscosity of between about 2 and about 30 Pa·s at a shear rate of 10 sec?1, a displacement creep of about 0.2 radians or less when a stress of 10 Pa is applied for about 2 minutes and a recovery time of about 60 seconds or less to reach a delta of 35 degrees after a torque of about 100 microN·m is applied for about 60 seconds at a frequency of 1 Hz and immediately followed by a torque of 80 microN·m at a frequency of 1 Hz. The adhesive layer can be used in an optical assembly to bond a display panel to a substantially transparent substrate. The adhesive layer provides a cleavage strength between glass substrates of about 15 N/mm or less such that the optical assembly can be disassembled with little or no damage to the display panel or the substrate.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New spin-on, bonding compositions and methods of using those compositions are provided. The cured bonding compositions comprise a crosslinked oxazoline (either crosslinked with another oxazoline or with a crosslinking agent), and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can be thermally decomposed at 285° C. or higher to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New spin-on, bonding compositions and methods of using those compositions are provided. The cured bonding compositions comprise a crosslinked oxazoline (either crosslinked with another oxazoline or with a crosslinking agent), and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can be thermally decomposed at 285° C. or higher to allow the wafers to slide apart at the appropriate stage in the fabrication process.