Abstract: A semiconductor memory device may include a cell substrate; a mold structure including a plurality of gate electrodes stacked on the cell substrate; a channel structure penetrating the mold structure; a string select line on the mold structure; a string select channel structure penetrating the string select line and contacting the channel structure; an anti-arcing contact penetrating the mold structure; an insulating pattern between the anti-arcing contact and the plurality of gate electrodes; and an anti-arcing insulating pattern penetrating the string select line to be in contact with the anti-arcing contact.

Abstract: A three-dimensional semiconductor device includes a first substrate, a second substrate on the first substrate, the second substrate including pattern portions and a plate portion covering the pattern portions, the plate portion having a width greater than a width of each of the pattern portions and being connected to the pattern portions, a lower structure between the first substrate and the second substrate, horizontal conductive patterns on the second substrate, the horizontal conductive patterns being stacked while being spaced apart from each other in a direction perpendicular to an upper surface of the second substrate, and a vertical structure on the second substrate and having a side surface opposing the horizontal conductive patterns.

Abstract: A non-volatile memory device may replace a defective string selection line connected to a defective string of a defective memory block among a plurality of memory blocks with a replacement string selection line of a repair memory block; and access the replacement string selection line of the repair memory block instead of the defective string selection line of the defective memory block. The non-volatile memory device performs a repair operation in units of string selection lines and may efficiently use repair resources.

Abstract: A three-dimensional semiconductor device includes a first substrate, a second substrate on the first substrate, the second substrate including pattern portions and a plate portion covering the pattern portions, the plate portion having a width greater than a width of each of the pattern portions and being connected to the pattern portions, a lower structure between the first substrate and the second substrate, horizontal conductive patterns on the second substrate, the horizontal conductive patterns being stacked while being spaced apart from each other in a direction perpendicular to an upper surface of the second substrate, and a vertical structure on the second substrate and having a side surface opposing the horizontal conductive patterns.

Abstract: A non-volatile memory device may replace a defective string selection line connected to a defective string of a defective memory block among a plurality of memory blocks with a replacement string selection line of a repair memory block; and access the replacement string selection line of the repair memory block instead of the defective string selection line of the defective memory block. The non-volatile memory device performs a repair operation in units of string selection lines and may efficiently use repair resources.

Abstract: A semiconductor device includes a plurality of cell gate electrodes on a semiconductor substrate. End portions of the cell gate electrodes include stepped-pad regions that extend in a direction parallel to a surface of the semiconductor substrate. Vertical structures are on the semiconductor substrate and pass through the plurality of cell gate electrodes. The vertical structures respectively include a channel layer. Upper peripheral transistors are disposed on the semiconductor substrate. The upper peripheral transistors include an upper peripheral gate electrode at a level higher than a level of the plurality of cell gate electrodes, body patterns passing through the upper peripheral gate electrode and electrically connected to the pad regions, and gate dielectric layers between the upper peripheral gate electrode and the body patterns.

Abstract: A semiconductor device includes a plurality of cell gate electrodes on a semiconductor substrate. End portions of the cell gate electrodes include stepped-pad regions that extend in a direction parallel to a surface of the semiconductor substrate. Vertical structures are on the semiconductor substrate and pass through the plurality of cell gate electrodes. The vertical structures respectively include a channel layer. Upper peripheral transistors are disposed on the semiconductor substrate. The upper peripheral transistors include an upper peripheral gate electrode at a level higher than a level of the plurality of cell gate electrodes, body patterns passing through the upper peripheral gate electrode and electrically connected to the pad regions, and gate dielectric layers between the upper peripheral gate electrode and the body patterns.

Abstract: The driving circuit for an NDRO-FRAM includes several NDRO-FRAM (Non Destructive Non Volatile Ferroelectric Random Access Memory) cells each having a drain, a bulk, a source and a gate and arranged as a matrix. A plurality of reading word lines are separately connected to each drain of the NDRO-FRAM cells arranged in columns, and a plurality of writing word lines are separately connected to each bulk of the NDRO-FRM cells arranged in columns. Several data level transmission circuits for transmitting a data level of the NDRO-FRAM cells are also included, which are connected to a plurality of data level transmission circuits. Accordingly, the present invention is capable of reading and writing of data on the NDRO-FRAM cells.

Abstract: The driving circuit for an NDRO-FRAM includes several NDRO-FRAM (Non Destructive Non Volatile Ferroelectric Random Access Memory) cells each having a drain, a bulk, a source and a gate and arranged as a matrix. A plurality of reading word lines are separately connected to each drain of the NDRO-FRAM cells arranged in columns, and a plurality of writing word lines are separately connected to each bulk of the NDRO-FRM cells arranged in columns. Several data level transmission circuits for transmitting a data level of the NDRO-FRAM cells are also included, which are connected to a plurality of data level transmission circuits. Accordingly, the present invention is capable of reading and writing of data on the NDRO-FRAM cells.