Abstract: A system, apparatus, and method for cooling multiple electronics components that includes a plurality of heat spreaders where each heat spreader includes a first plate and a second plate. The first plate has a first body portion configured to form a thermal transfer relationship with a first side of a first electronic component. The second plate has a second body portion configured to form a thermal transfer relationship with a second side of the first electronic component. The heat spreader has an extending member extending to and overlapping with a portion of a cold plate arranged to cool a second electronics component.

Abstract: An apparatus is provided for cooling a first heat source surrounded by a plurality of second heat sources in which a second heat sink for the plurality of heat sources is attached to a first heat sink connected to the first heat source. The apparatus avoids requiring dedicated mounts on the device for the second heat sink by employing the first heat sink to effectively sandwich the second heat sink against the plurality of heat sources. Embodiments further enhance the heat transfer by distributing heat pipes within fins of the first heat sink and by facing two sides of the first heat sink to create a duct through which airflow is channeled.

Abstract: Described herein is a wireless-telecom server for implementation proximate a remote radio-unit (RRU) (e.g., on a same pole as the RRU). The server includes an internal enclosure with wireless-telecom network cards and a dielectric liquid disposed therein. The server also includes pumps configured to circulate the dielectric liquid within the internal enclosure. The server further includes a network connection configured to communicate with a network, radio connection configured to communicate with the RRU, and a power connection configured to supply power to the server. The network connection, the radio connection, and the power connection pass through a wall of the internal enclosure. The server also includes fans configured to direct air around the internal enclosure. By configuring the server for placement proximate the RRU, a need for a server room near the RRU and/or a high number of long fiber-optic cable runs may be obviated.

Abstract: A portable baking assembly includes a portable housing, a receiving base, and an air flow assembly. The receiving base is disposed in the portable housing. The receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. The air flow assembly is received in the portable housing and in fluid communication with the receiving base. The air flow assembly includes an inlet conduit that is operable to receive heated air and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.