Abstract: The present invention relates to a novel organic compound and an organic light emitting device including the same, and more specifically provides an organic electroluminescent device with remarkably improved light emitting efficiency and service life.

Abstract: An indoor live ammunition shooting range facility system includes a ventilation facility installed in an indoor live ammunition shooting range, and configured to ventilate air of the indoor live ammunition shooting range; a targeting device facility installed in the indoor live ammunition shooting range, and configured to provide a shooting target; a bulletproof facility installed to protect components exposed to an inside of the indoor live ammunition shooting range among components configuring the ventilation facility and the target device facility and to protect a wall surface of the indoor live ammunition shooting range; a bullet head recovery facility installed on a side opposite to a shooting position, and configured to recover a bullet head; and a control facility installed in the indoor live ammunition shooting range, and configured to control the ventilation facility, the target device facility and the bullet head recovery facility.

Abstract: A device and a method for collecting, analyzing and integrating log data of an in-vehicle infotainment (IVI) system are disclosed. The method for collecting, analyzing and integrating log data of an IVI system includes identifying model information of a vehicle to be a target of digital forensics, hardware information and software information related to the IVI system of the vehicle, collecting target data for the digital forensics based on the model information, the hardware information and the software information, and storing the collected target data in an integrated database.

Abstract: A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, at least one connection bump between the first semiconductor chip and the second semiconductor chip, an underfill in a region below the second semiconductor chip and on a side of the at least one connection bump and a molding layer on the first semiconductor chip and on a side of the second semiconductor chip, wherein an upper surface of the second semiconductor chip is above an upper surface of the molding layer, a height difference between the upper surface of the second semiconductor chip and the upper surface of the molding layer is 0.3 ?m to 2.0 ?m, and a surface roughness of the upper surface of the second semiconductor chip is 3 nm or less.

Abstract: An endothermic pouch assembly includes an endothermic pouch with liquid-impregnated absorbent material sealed inside, and a pouch cartridge including a pair of rim frames that bind a heat-fusion sealing portion formed along the rim of the endothermic pouch at both sides.

Abstract: Provided is a method for fabricating a semiconductor package. The method includes partially cutting a wafer along a boundary of a unit wafer to form a transparent substrate including a first part having a first width and a second part and mounting an image sensor chip on the second part of the transparent substrate. The image sensor chip includes a redistribution insulation layer, a redistribution layer in the redistribution insulation layer, a first substrate layer on the redistribution insulation layer, and a penetration electrode penetrating the first substrate layer and electrically connecting the redistribution layer. The method further includes forming a mold layer on the transparent substrate, covering side surfaces of the second part and side surfaces of the image sensor chip, forming a connection terminal on the image sensor chip, and cutting the transparent substrate and the mold layer along the boundary of the unit wafer.

Abstract: Provided is a semiconductor package. The semiconductor package includes an image sensor chip including a first surface and a second surface opposite to each other in a first direction; a transparent substrate spaced apart from the second surface of the image sensor chip in a second direction, wherein the transparent substrate includes a first part and a second part with a width different from the first part; an adhesive layer disposed between the second surface of the image sensor chip and the first part of the transparent substrate; and a mold layer on the second part of the transparent substrate, wherein the mold layer comprises side surfaces that extend along the first part of the transparent substrate, and further extend along side surfaces of the adhesive layer and side surfaces of the image sensor chip, and not extending along the first surface of the image sensor chip.

Abstract: A prismatic secondary battery includes a case made of a metal, at least one electrode assembly accommodated in the case, at least one heat absorbing pouch in contact with the electrode assembly, and an electrolyte filling the case, wherein the heat absorbing pouch includes an absorbent material impregnated with a liquid vaporized by absorbing heat generated from the electrode assembly, and a pouch configured to seal and accommodate the absorbent material impregnated with the liquid.

Abstract: Provided is a semiconductor package including a printed circuit board (PCB) substrate, a silicon substrate on the PCB substrate, a plurality of through vias penetrating the silicon substrate, a plurality of pads on the silicon substrate and connected to at least some of the plurality of through vias, a semiconductor chip on the plurality of pads and electrically connected to the plurality of pads, and a plurality of connecting terminals between the semiconductor chip and the plurality of pads, wherein the plurality of pads include a first pad that includes a trench and a second pad, and wherein the plurality of connecting terminals include a first connecting terminal connected to the first pad, at least a part of the first connecting terminal being in the trench and a remaining part of the first connecting terminal being on the first pad, and a second connecting terminal connected to the second pad.

Abstract: A semiconductor package comprising: a first semiconductor chip extending in each of first and second directions that intersect each other; a second semiconductor chip on the first semiconductor chip in a third direction perpendicular to the first and second directions, wherein the second semiconductor chip includes a first area and a second area that is adjacent to and extends around the first area; and a bump structure and a conductive material layer between the first and second semiconductor chips, wherein the conductive material layer is on the bump structure, wherein the bump structure includes a first bump structure overlapping the first area in the third direction, and a second bump structure overlapping the second area in the third direction, wherein the first and second bump structures are spaced apart from each other, and a thickness of the second bump structure is larger than a thickness of the first bump structure.

Abstract: An indoor live ammunition shooting range facility system includes a ventilation facility installed in an indoor live ammunition shooting range, and configured to ventilate air of the indoor live ammunition shooting range; a targeting device facility installed in the indoor live ammunition shooting range, and configured to provide a shooting target; a bulletproof facility installed to protect components exposed to an inside of the indoor live ammunition shooting range among components configuring the ventilation facility and the target device facility and to protect a wall surface of the indoor live ammunition shooting range; a bullet head recovery facility installed on a side opposite to a shooting position, and configured to recover a bullet head; and a control facility installed in the indoor live ammunition shooting range, and configured to control the ventilation facility, the target device facility and the bullet head recovery facility.

Abstract: Provided is a semiconductor package. The semiconductor package includes an image sensor chip including a first surface and a second surface opposite to each other in a first direction; a transparent substrate spaced apart from the second surface of the image sensor chip in a second direction, wherein the transparent substrate includes a first part and a second part with a width different from the first part; an adhesive layer disposed between the second surface of the image sensor chip and the first part of the transparent substrate; and a mold layer on the second part of the transparent substrate, wherein the mold layer comprises side surfaces that extend along the first part of the transparent substrate, and further extend along side surfaces of the adhesive layer and side surfaces of the image sensor chip, and not extending along the first surface of the image sensor chip.

Abstract: The present invention relates to a novel organic compound and an organic light emitting device including the same, and more specifically provides an organic electroluminescent device with remarkably improved light emitting efficiency and service life.

Abstract: A method for establishing a plurality of protocol data unit (PDU) sessions between a user equipment (UE) and a data network (DN) by the UE may comprise transmitting a message to establish the plurality of PDU sessions to at least one network function (NF) of a plurality of NFs, exchanging a signal to establish the plurality of PDU sessions among the UE, a radio access network (RAN), and the plurality of NFs based on the message, and establishing the plurality of PDU sessions between the UE and the DN according to predetermined priority and based on the signal, wherein each of the plurality of PDU sessions corresponds to a network slice (NS) for a particular service, wherein the message includes information about the particular service corresponding to the plurality of PDU sessions, and wherein the priority is determined based on the information about the particular service.

Abstract: Provided are a silicon oxide-carbon composite, a method of preparing the same, and an energy storage device containing the same. In the method of preparing a silicon oxide-carbon composite, a reaction solution containing an organic solvent including an aromatic compound is provided. Crystalline carbon structures are formed by generating plasma in the reaction solution. A slurry is formed by adding silicon halide and a polyol in the reaction solution in which the crystalline carbon structures are dispersed. The slurry is separated from the organic solvent and subjected to thermal treatment.

Abstract: The present invention provides a bullet collecting box which is installed with a plurality of rubber plates in the bullet collecting box having a rectangular parallelepiped shape and filled with rubber powder filling materials having a particle size of 0.1 to 3 mm therein, thereby collecting the bullets fired in the indoor shooting range without damage, and a bullet collecting system which can be used by installing the bullet collecting box in the indoor shooting range. Also, the present invention provides a bullet collecting system for preventing occurrence of lead fume in the indoor shooting range, in which the beaten zone of the indoor shooting range is newly improved from an existing system of using an iron plate to a system of using powder filling materials, thereby preventing the leakage of lead fume, and contributing to an early normalization of the shooting range and a creative national defense.

Abstract: The present disclosure relates to a 5G or pre-5G communication system for supporting higher data transmission rates beyond 4G communication systems such as LTE systems.

Abstract: Provided are a silicon oxide-carbon composite, a method of preparing the same, and an energy storage device containing the same. In the method of preparing a silicon oxide-carbon composite, a reaction solution containing an organic solvent including an aromatic compound is provided. Crystalline carbon structures are formed by generating plasma in the reaction solution. A slurry is formed by adding silicon halide and a polyol in the reaction solution in which the crystalline carbon structures are dispersed. The slurry is separated from the organic solvent and subjected to thermal treatment.

Abstract: Provided are a silicon oxide-carbon composite, a method of preparing the same, and an energy storage device containing the same. In the method of preparing a silicon oxide-carbon composite, a reaction solution containing an organic solvent including an aromatic compound is provided. Crystalline carbon structures are formed by generating plasma in the reaction solution. A slurry is formed by adding silicon halide and a polyol in the reaction solution in which the crystalline carbon structures are dispersed. The slurry is separated from the organic solvent and subjected to thermal treatment.

Abstract: Provided are a carbon structure, a method of manufacturing the carbon structure, and an energy storage device having the carbon structure. According to the method of manufacturing the carbon structure, a reaction solution containing a catalyst and an organic solvent containing an aromatic compound is provided. Plasma is generated in the reaction solution, thereby forming a crystalline carbon structure.