Patents by Inventor Sun-Mi Kim
Sun-Mi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12224128Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.Type: GrantFiled: April 26, 2023Date of Patent: February 11, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyo Sung Choi, Jung Jin Park, Ho Sam Choi, Jae Won Kim, Sun Mi Kim, Jong Ho Lee
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Publication number: 20250029786Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in the third direction; a side margin portion disposed on the fifth and sixth surfaces; and an external electrode disposed on the third and fourth surfaces, wherein the side margin portion includes polydopamine, and wherein an average size of the plurality of dielectric grains included in the side margin portion is different from an average size of the plurality of dielectric grains included in the dielectric layer.Type: ApplicationFiled: March 25, 2024Publication date: January 23, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong PARK, Jung Jin PARK, Kwan Soo PARK, Jong Ho LEE, Chang Ho SEO, Sun Mi KIM, Hyun Sik CHAE
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Publication number: 20250029787Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the cover portion includes polydopamine.Type: ApplicationFiled: April 4, 2024Publication date: January 23, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Jin PARK, Yong PARK, Kwan Soo PARK, Ho Sam CHOI, Rak Hyeon BAEK, Hyo Sung CHOI, Sun Mi KIM, Jong Ho LEE
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Patent number: 12205833Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.Type: GrantFiled: May 26, 2023Date of Patent: January 21, 2025Assignee: SEMES CO., LTD.Inventors: Sun Mi Kim, Jisu Hong, Moonsik Choi, Oh Jin Kwon
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Patent number: 12173142Abstract: The present disclosure relates to a polyethylene having high degree of crosslinking and a crosslinked polyethylene pipe including the same. The polyethylene according to the present disclosure has a high content of ultra-high molecular weight, and thus a crosslinking rate is improved, and thus a sufficient degree of crosslinking is exhibited even when the crosslinking time is shortened, thereby exhibiting excellent strength and pressure resistance characteristics.Type: GrantFiled: February 20, 2020Date of Patent: December 24, 2024Assignee: LG Chem, Ltd.Inventors: Sol Cho, Hyunsup Lee, Sun Mi Kim, Yi Young Choi, Myunghan Lee, Yeonsoo Kim
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Publication number: 20240387114Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces; and a first side margin portion and a second side margin portion, respectively disposed on the fifth and sixth surfaces, wherein the first and second side margin portions include a first extension portion disposed to extend onto a portion of the first surface and a portion of the second surface.Type: ApplicationFiled: February 27, 2024Publication date: November 21, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Ho SEO, Jong Ho LEE, Yong Min HONG, Jung Tae PARK, Min Woo KIM, Yong PARK, Sun Mi KIM
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Publication number: 20240347275Abstract: A method for manufacturing a multilayer electronic component includes: preparing first ceramic green sheets on which first internal electrode patterns are formed spaced apart from each other and second ceramic green sheets on which second internal electrode patterns are formed spaced apart from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheets and the second ceramic green sheets for the first internal electrode patterns and the second internal electrode patterns to be cross-stacked on each other; obtaining a multilayer body by cutting the ceramic green sheet stack to have a side surface to which distal edges of the first and second internal electrode patterns are exposed; adhering an adhesive layer to the side surface to which the distal edges of the first and second internal electrode patterns of the multilayer body are exposed; and peeling the adhesive layer from the side surface.Type: ApplicationFiled: June 24, 2024Publication date: October 17, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Eun Jung Lee, Jung Tae Park, Min Woo Kim, Chang Ho Seo, Sung Soo Choi, Sun Mi Kim
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Publication number: 20240294680Abstract: Provided are a polyethylene capable of improving tensile strength while maintaining excellent processability and Mooney viscosity characteristics when preparing a chlorinated polyethylene compound by implementing a molecular structure having a low content of low molecular weight and a high content of high molecular weight, and a chlorinated polyethylene prepared using the same.Type: ApplicationFiled: April 25, 2024Publication date: September 5, 2024Applicant: LG Chem, Ltd.Inventors: Cheolhwan Jeong, Si Jung Lee, Sun Mi Kim, Ue Ryung Seo, Yi Young Choi, Bog Ki Hong
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Patent number: 12065514Abstract: The present disclosure relates to a polyethylene having high pressure resistance and a crosslinked polyethylene pipe including the same. The polyethylene according to the present disclosure has high melt index and density and exhibits a sufficient degree of crosslinking, thereby exhibiting excellent strength and pressure resistance characteristics.Type: GrantFiled: February 20, 2020Date of Patent: August 20, 2024Assignee: LG Chem, Ltd.Inventors: Sol Cho, Hyunsup Lee, Sun Mi Kim, Yi Young Choi, Myunghan Lee, Yeonsoo Kim
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Patent number: 12057270Abstract: A method for manufacturing a multilayer electronic component includes: preparing first ceramic green sheets on which first internal electrode patterns are formed spaced apart from each other and second ceramic green sheets on which second internal electrode patterns are formed spaced apart from each other; forming a ceramic green sheet stack by stacking the first ceramic green sheets and the second ceramic green sheets for the first internal electrode patterns and the second internal electrode patterns to be cross-stacked on each other; obtaining a multilayer body by cutting the ceramic green sheet stack to have a side surface to which distal edges of the first and second internal electrode patterns are exposed; adhering an adhesive layer to the side surface to which the distal edges of the first and second internal electrode patterns of the multilayer body are exposed; and peeling the adhesive layer from the side surface.Type: GrantFiled: January 14, 2022Date of Patent: August 6, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Eun Jung Lee, Jung Tae Park, Min Woo Kim, Chang Ho Seo, Sung Soo Choi, Sun Mi Kim
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Publication number: 20240234034Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.Type: ApplicationFiled: April 26, 2023Publication date: July 11, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyo Sung CHOI, Jung Jin PARK, Ho Sam CHOI, Jae Won KIM, Sun Mi KIM, Jong Ho LEE
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Publication number: 20240222010Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. Each of the side margin portions includes a first region adjacent to the internal electrodes, and a second region adjacent to an outside of each of the side margin portions. An average Sn amount of the first region is lower than an average Sn amount of the second region. An Sn amount of the first region gradually increases from a side of the internal electrodes to the second region.Type: ApplicationFiled: June 22, 2023Publication date: July 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eun Jung Lee, Hyun Sik Chae, Sun Mi Kim, Dong Jun Jung, Jong Ho Lee
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Publication number: 20240203661Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction; external electrodes disposed on the body; and side margin portions disposed on the body, wherein an average content of Sn included in the side margin portion is 0.1 mol % or more and 4.0 mol % or less, wherein a Ba/Ti ratio of the side margin portion is greater than 1.040 and less than 1.070, and wherein an average size of a plurality of dielectric grains included in the side margin portion satisfies 100 nm or more and 290 nm or less.Type: ApplicationFiled: October 27, 2023Publication date: June 20, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sim Chung KANG, Jong Ho LEE, Eun Jung LEE, Hyun Sik CHAE, Sun Mi KIM, Dae Jin SHIM
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Patent number: 12006378Abstract: There are provided a polyethylene capable of improving tensile strength while maintaining excellent processability and Mooney viscosity characteristics when preparing a chlorinated polyethylene compound by implementing a molecular structure having a low content of low molecular weight and a high content of high molecular weight, and a chlorinated polyethylene prepared using the same.Type: GrantFiled: September 25, 2020Date of Patent: June 11, 2024Assignee: LG Chem, Ltd.Inventors: Cheolhwan Jeong, Si Jung Lee, Sun Mi Kim, Ue Ryung Seo, Yi Young Choi, Bog Ki Hong
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Patent number: 11993665Abstract: Provided are a hybrid supported catalyst which includes two or more kinds of transition metal compounds having the following Chemical Formulas 1 and 2, thereby preparing a polyolefin, particularly, a high-density polyethylene having a molecular structure which is optimized to improve tensile strength of a chlorinated polyolefin compound, and a method of preparing a polyolefin using the same: wherein all the variables are described herein.Type: GrantFiled: September 25, 2020Date of Patent: May 28, 2024Assignee: LG Chem, Ltd.Inventors: Sun Mi Kim, Ue Ryung Seo, Bog Ki Hong, Eun Kyoung Song, Daesik Hong, Si Jung Lee, Cheolhwan Jeong, Kiju Um
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Publication number: 20240170216Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.Type: ApplicationFiled: July 5, 2023Publication date: May 23, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Jin PARK, Dae Jin SHIM, Jung Jin PARK, Jae Won KIM, Hyo Sung CHOI, Ho Sam CHOI, Sun Mi KIM, Jong Ho LEE
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Patent number: 11975037Abstract: The present specification relates to a composition for preventing, alleviating or treating burnout syndrome, containing a natural extract as an active ingredient. According to one aspect of the present invention, the composition contains a ginseng fruit extract, and thus is useful for preventing, treating and alleviating burnout syndrome. In addition, according to one aspect of the present invention, the composition further contains ginseng fruit and one or more selected from the group consisting of red ginseng, Angelica gigas, Cornus officinalis, Cervi parvum corni, and Nigella sativa, so as to maximize the synergistic effect among two or more ingredients, thereby exhibiting excellent effects on the prevention, treatment and alleviation of burnout syndrome. Therefore, there is an advantage of making individuals and society mentally and physically healthy since burnout syndrome can be prevented, treated and alleviated, by using the composition of the present invention.Type: GrantFiled: February 5, 2016Date of Patent: May 7, 2024Assignee: AMOREPACIFIC CORPORATIONInventors: Su-Hwan Kim, Chan-Woong Park, Sun Mi Kim, Juewon Kim, Byung Gyu Kim, Wan Gi Kim, Sang Jun Lee
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Publication number: 20240145173Abstract: A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.Type: ApplicationFiled: June 2, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyeon LEE, Jong Ho LEE, Eun Jung LEE, Yong Min HONG, Yong PARK, Min Woo KIM, Jung Tae PARK, Sun Mi KIM, Sim Chung KANG
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Publication number: 20240112864Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.Type: ApplicationFiled: July 10, 2023Publication date: April 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong PARK, Jung Tae PARK, Jong Ho LEE, Eun Jung LEE, Yong Min HONG, Jung Jin PARK, Rak Hyeon BAEK, Sun Mi KIM, Yong Ung LEE
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Publication number: 20240076766Abstract: Provided are a QT heat treated high carbon hot rolled steel sheet, a high carbon cold rolled steel sheet, a QT heat treated high carbon cold rolled steel sheet, and manufacturing methods thereof, wherein the QT heat treated high carbon hot rolled steel sheet comprises, in weight %, C: 1.0-1.4%, Si: 0.1-0.4%, Mn: 0.1-0.8%, Cr: 0.3-11%, W: 0.05-2.5%, P: 0.03% or less, S: 0.03% or less, Al: 0.02% or less, and the balance being Fe and other inevitable impurities, the average size of carbides being 0.1-20 ?m.Type: ApplicationFiled: December 10, 2021Publication date: March 7, 2024Applicant: POSCO Co., LtdInventors: Sun-Mi KIM, Jae-Hun CHOI, Hak-Jun KIM