Patents by Inventor Sun Myung Lee

Sun Myung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation method of copper green rust pigment that can replace Hayeob pigment in traditional Dancheong
    Patent number: 11999859
    Abstract: The present invention relates to a preparation method of a copper green rust pigment, particularly a preparation method of a copper green rust pigment that can replace the traditional Dancheong Hayeob pigment comprising the following steps: a step of preparing a copper powder comprising at least one of copper; and a copper alloy comprising copper and at least one of tin (Sn), zinc (Zn), and lead (Pb); and a step of corroding the copper powder by mixing the copper powder with a corrosive agent containing sodium chloride and ammonium chloride. The corrosive agent includes 75 to 90 weight % of the sodium chloride and 10 to 25 weight % of the ammonium chloride based on the total weight.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: June 4, 2024
    Assignee: National Research Institute of Cultural Heritage
    Inventors: Yeong Seok Kang, Sun Myung Lee, Ju Hyun Park, Seong Woo Mun
  • Refrigerator
    Patent number: 11920856
    Abstract: A refrigerator includes a storage chamber having an opening; a drawer type door to open or close the opening; a display positioned at the drawer type door; a first connector provided at a sidewall of the storage chamber; a second connector provided at the drawer type door and being electrically connected to the display; a first frame coupled to an inner wall of the storage chamber, the first frame to cover the first connector; a second frame coupled to the drawer type door, the second frame to support a storage box; and a wire electrically connected between the first connector and the second connector. The first frame has a first accommodating part to accommodate one portion of the wire and the second frame has a second accommodating part to accommodate another portion of the wire.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Myung Han, Jae Hoon Lim, Gi Joong Jeong, Woo Yeol Yoo, Jong Eun Chae, Sun keun Lee
  • Lead-free solder composition for glass
    Patent number: 9333594
    Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: May 10, 2016
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Korea Autoglass Corporation, Heesung Material Ltd.
    Inventors: Hae Won Jeong, Hyun Dal Park, Tae Seung Lee, Seung Kyu Kim, Hong Nho Joo, Ho June Yoon, Min Ho Bak, Joo Dong Lee, Hyun Chae Jung, Sun Myung Lee
  • LEAD-FREE SOLDER COMPOSITION FOR GLASS
    Publication number: 20140044589
    Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
    Type: Application
    Filed: December 12, 2012
    Publication date: February 13, 2014
    Applicants: HYUNDAI MOTOR COMPANY, HEESUNG MATERIAL LTD., KOREA AUTOGLASS CORPORATION, KIA MOTORS CORPORATION
    Inventors: Hae Won Jeong, Hyun Dal Park, Tae Seung Lee, Seung Kyu Kim, Hong Nho Joo, Ho June Yoon, Min Ho Bak, Joo Dong Lee, Hyun Chae Jung, Sun Myung Lee