Patents by Inventor Sunping Lian

Sunping Lian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11638885
    Abstract: The present disclosure provides a cup lid and a self-producing water cup. The cup lid includes: a housing, a condensing mechanism, and a heat dissipation mechanism. The housing defines a housing space, an air inlet, an air outlet, and a water outlet. The air inlet, the air outlet, and the water outlet are connected to an outside. The air inlet, the air outlet, and the water outlet are connected to the housing space. The condensing mechanism is housed in the housing and connected to the air inlet. The condensing mechanism is configured to condense air flowing from the air inlet into water, and the water flows out through the water outlet. The heat dissipation mechanism is housed in the housing and connected to the air outlet. The heat dissipation mechanism is configured to dissipate heat generated by the condensing mechanism.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: May 2, 2023
    Assignee: SHENZHEN ZEER ELECTRONIC COMMERCE CO., LTD
    Inventors: Sunping Lian, Dongming Li, Zhijiang Wu
  • Publication number: 20230022498
    Abstract: The present disclosure provides a cup lid and a self-producing water cup. The cup lid includes: a housing, a condensing mechanism, and a heat dissipation mechanism. The housing defines a housing space, an air inlet, an air outlet, and a water outlet. The air inlet, the air outlet, and the water outlet are connected to an outside. The air inlet, the air outlet, and the water outlet are connected to the housing space. The condensing mechanism is housed in the housing and connected to the air inlet. The condensing mechanism is configured to condense air flowing from the air inlet into water, and the water flows out through the water outlet. The heat dissipation mechanism is housed in the housing and connected to the air outlet. The heat dissipation mechanism is configured to dissipate heat generated by the condensing mechanism.
    Type: Application
    Filed: January 6, 2022
    Publication date: January 26, 2023
    Inventors: SUNPING LIAN, DONGMING LI, ZHIJIANG WU
  • Patent number: D846267
    Type: Grant
    Filed: May 27, 2017
    Date of Patent: April 23, 2019
    Assignee: Shenzhen Qianhai Yafei Supply Chain Co., ltd
    Inventor: Sunping Lian