Patents by Inventor Sunrak Kim

Sunrak Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-stepped boat assembly for receiving semiconductor packages
    Patent number: 9881822
    Abstract: A multi-stepped boat assembly includes a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in the stack hole. A guide boat has at least one guide hole vertically aligned with the at least one stack hole. The guide boat is removably attachable to the stack boat. An inner sidewall of the stack hole includes a first step configured to receive the first semiconductor package, and a second step provided on the first step and configured to receive the second semiconductor package. The guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: January 30, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sunrak Kim, Hohyeuk Im
  • Multi-Stepped Boat Assembly for Receiving Semiconductor Packages
    Publication number: 20160086834
    Abstract: A multi-stepped boat assembly includes a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in the stack hole. A guide boat has at least one guide hole vertically aligned with the at least one stack hole. The guide boat is removably attachable to the stack boat. An inner sidewall of the stack hole includes a first step configured to receive the first semiconductor package, and a second step provided on the first step and configured to receive the second semiconductor package. The guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.
    Type: Application
    Filed: September 16, 2015
    Publication date: March 24, 2016
    Inventors: Sunrak Kim, Hohyeuk Im