Abstract: A semiconductor package is provided. a semiconductor package comprises a package substrate, an interposer attached onto the package substrate, a first semiconductor chip attached onto the interposer by a first bonding member, a second bonding member positioned on the interposer and spaced apart from the first semiconductor chip, a cover glass positioned on the second bonding member and an encapsulant encapsulating the package substrate, the interposer, and the cover glass.

Abstract: Disclosed, in an embodiment, is a motor comprising: a stator; a rotor disposed inside the stator; a shaft coupled to the rotor; and a bus bar disposed on the stator. The bus bar includes a bus bar holder and a plurality of terminals disposed on the bus bar holder. Each of the terminals includes a body disposed in the bus bar holder, an extension part extending inwardly from the body, and a protrusion part protruding in the axial direction from the end of the extension part. The body, the extension part, and the protrusion part are integrated. The body of each of the terminals is disposed on the same virtual plane, and the protrusion part of each of the terminals is disposed so as to be exposed from the bus bar holder.

Abstract: Disclosed herein is a gas oven including a body, a cooking space formed in the body, an air supply flow channel configured to connect the cooking space with an outside of the body to supply air to the cooking space, and a distribution unit configured to distribute or bend the air supplied through the air supply flow channel to supply the air to the cooking space. Through the distribution unit, it is possible to smoothly supply a primary air for mixing with gas and to smoothly supply a secondary air to an inside of the cooking space.

Abstract: Disclosed herein is a gas oven including a body, a cooking space formed in the body, an air supply flow channel configured to connect the cooking space with an outside of the body to supply air to the cooking space, and a distribution unit configured to distribute or bend the air supplied through the air supply flow channel to supply the air to the cooking space. Through the distribution unit, it is possible to smoothly supply a primary air for mixing with gas and to smoothly supply a secondary air to an inside of the cooking space.