Abstract: A semiconductor package and a package method are provided. The semiconductor package includes: a first carrier board having a plurality of first assembly surfaces and a first surface, where signal exchange ports are provided on the first surface; a plurality of package structures, each corresponding to one of the plurality of first assembly surfaces, where each package structure is welded on its corresponding first assembly surface and electrically connected to the first carrier board, where an end of at least one of the plurality of package structures is exposed and faces away from the first surface of the first carrier board; and a High Bandwidth Memory (HBM) structure welded on and electrically connected to a surface of the end of the at least one of the plurality of package structures that face the first carrier board.

Abstract: A package structure includes a substrate having conductive lines along a direction parallel to a surface of the substrate, and an optoelectronic chip bonded on the first substrate. A part of areas of the substrate is a first substrate, and remaining areas of the substrate are a second substrate. A base material of the first substrate is a light-transparent material, the first substrate has the conductive lines, and a base material of the second substrate is a non-light-transparent material. An active area of the optoelectronic chip is oriented toward the first substrate. The active area is arranged staggered with the conductive lines in the first substrate, and the optoelectronic chip is electrically connected with the conductive lines in the first substrate.

Abstract: Provided is an etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with a chip. The structure comprises a metal substrate frame, wherein a base island and pins are arranged in the metal substrate frame; a chip is inversely arranged on a front face of the base island and the pins; a conductive pillar is arranged on a front face of the pins; the region on the periphery of the base island, the region between the base island and the pins, the region between one pin and another, the region above the base island and the pins, the region below the base island and the pins, and the outside of the chip and the conductive pillar are all enveloped with a plastic packaging material.

Abstract: Provided is an etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with a chip. The structure comprises a metal substrate frame, wherein a base island and pins are arranged in the metal substrate frame; a chip is inversely arranged on a front face of the base island and the pins; a conductive pillar is arranged on a front face of the pins; the region on the periphery of the base island, the region between the base island and the pins, the region between one pin and another, the region above the base island and the pins, the region below the base island and the pins, and the outside of the chip and the conductive pillar are all enveloped with a plastic packaging material.