Patents by Inventor Sunyoung IM

Sunyoung IM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device comprising interposer printed circuit board
    Patent number: 12745349
    Abstract: An electronic device including an interposer printed circuit board (PCB) may comprise: an interposer PCB including at least two vias; a first PCB including a first direct connection unit including a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB including a second direct connection unit including a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.
    Type: Grant
    Filed: August 2, 2024
    Date of Patent: September 22, 2026
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myungkyoon Chung, Sunyoung Im, Dohyeong Park
  • ELECTRONIC DEVICE COMPRISING INTERPOSER PRINTED CIRCUIT BOARD
    Publication number: 20240397625
    Abstract: An electronic device including an interposer printed circuit board (PCB) may comprise: an interposer PCB including at least two vias; a first PCB including a first direct connection unit including a power supply circuit and configured to directly connect the power supply circuit to a first via, and a first extension connection unit comprising a conductive material configured to connect a second via through a wire extending from the first direct connection unit; and a second PCB including a second direct connection unit including a load circuit and configured to directly connect the load circuit to the second via, and a second extension connection unit comprising a conductive material configured to connect the first via through a wire extending from the second direct connection unit.
    Type: Application
    Filed: August 2, 2024
    Publication date: November 28, 2024
    Inventors: Myungkyoon CHUNG, Sunyoung IM, Dohyeong PARK