Patents by Inventor Suo-Hsia Tang

Suo-Hsia Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board with identifiable information and method for fabricating the same
    Patent number: 8070932
    Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: December 6, 2011
    Assignee: Unimicron Technology Corp.
    Inventors: Shih-Ping Hsu, Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih
  • Circuit board with identifiable information and method for fabricating the same
    Publication number: 20080166497
    Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
    Type: Application
    Filed: March 18, 2008
    Publication date: July 10, 2008
    Inventors: Shih-Ping Hsu, Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih
  • Circuit board with identifiable information and method for fabricating the same
    Patent number: 7365272
    Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: April 29, 2008
    Assignee: Phoenix Precision Technology Corporation
    Inventors: Shih-Ping Hsu, Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih
  • Circuit board with identifiable information and method for fabricating the same
    Publication number: 20050236176
    Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
    Type: Application
    Filed: August 20, 2004
    Publication date: October 27, 2005
    Inventors: Shih-Ping Hsu, Shang-Wei Chen, Suo-Hsia Tang, Chao-Wen Shih