Abstract: In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit sends or receives optical signals. The pluggable optical coupling connector is adjacent to the photonic integrated circuit and includes a pluggable interface to optically couple a fiber array to the photonic integrated circuit. Further, the electronic integrated circuit, the photonic integrated circuit, and the pluggable optical coupling connector are all embedded in a mold.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for creating an integrated photonics package that includes a photonics IC, an electronic IC, and an optical coupling connector that are molded within a single package. In embodiments, caps may be used to protect optical components during manufacture. Other embodiments may be described and/or claimed.

Abstract: Technologies for optical coupling to photonic integrated circuit (PIC) dies are disclosed. In one illustrative embodiment, a PIC die has one or more waveguides and one or more vertical couplers to reflect light from the waveguides through a surface of the PIC die. An optical connector interface is positioned on the surface of the PIC die with high precision. The optical connector interface includes one or more lenses to collimate light from the one or more waveguides. An optical connector is plugged into the optical connector interface. The optical connector includes one or more lenses to focus the collimated light to one or more optical fibers. As the optical connector is coupling to collimated light, it does not need to be positioned with high precision.

Abstract: Monolithic optical interconnect component components for surface mounting to photonic IC (PIC) chip assemblies. A protrusion or detent in solid body of the component comprises a contact alignment surface that stands off from a remainder of the solid body and is sloped to facilitate passive alignment of the component to a surface feature of the PIC chip. A face of the solid body may include an interference fitting to receive an MT ferrule connector. An optical interconnect component may include an array of optical elements and/or optical waveguides embedded within a solid body and extending between faces of the solid body. Once assembled, a multi-fiber push-on (MPO) connector may be inserted into the surface mounted interconnect component to optically couple a fiber cable to the PIC chip.

Abstract: Alerts, such as laser driver current alarms, are triggered in an optoelectronic device based on dynamic digital diagnostics, such as operating temperature. Optoelectronic devices may execute microcode structured to represent a formulaic relation between a first parameter (e.g., temperature) and an indicator value for a second parameter (e.g., laser driver current). The microcode may further be structured to cause the optoelectronic device to access the first parameter, calculate an indicator value for the second parameter based on the accessed first parameter using the formulaic relation, access the second parameter, and compare the indicator value with the second parameter to determine whether to trigger an alert. If the second parameter exceeds the indicator value, the alert may be triggered, and may be indicative of potentially imminent optoelectronic device failure.

Abstract: Alerts, such as laser driver current alarms, are triggered in an optoelectronic device based on dynamic digital diagnostics, such as operating temperature. Optoelectronic devices may execute microcode structured to represent a formulaic relation between a first parameter (e.g., temperature) and an indicator value for a second parameter (e.g., laser driver current). The microcode may further be structured to cause the optoelectronic device to access the first parameter, calculate an indicator value for the second parameter based on the accessed first parameter using the formulaic relation, access the second parameter, and compare the indicator value with the second parameter to determine whether to trigger an alert. If the second parameter exceeds the indicator value, the alert may be triggered, and may be indicative of potentially imminent optoelectronic device failure.

Abstract: Systems and methods for monitoring wavelength in wavelength division multiplexed systems. A thin film filter is used with a pair of photodiodes to monitor the emitted wavelength of a laser. The thin film filter is configured to both reflect and transmit light equally at a particular wavelength of interest. The ratio between the optical power of the transmitted light and optical power of the reflected light can be used to detect wavelength drift. When the laser is drifting or is no longer emitting at the target wavelength, the wavelength locker can automatically adjust a temperature of the laser. Adjusting the temperature of the laser can change the emitted wavelength of the laser such that the emitted wavelength matches a target wavelength.