Patents by Inventor Supakrits Suttiwat

Supakrits Suttiwat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Down Bond in Semiconductor Devices
    Publication number: 20190221502
    Abstract: An apparatus includes a lead frame paddle configured for mounting a semiconductor die. The apparatus further includes a plating area formed on the lead frame paddle. The plating area is configured to receive a down bond from a semiconductor die placed on the lead frame paddle. The apparatus further includes an exposed gap between an outer edge of the plating area and an outer edge of the lead frame paddle.
    Type: Application
    Filed: March 29, 2018
    Publication date: July 18, 2019
    Applicant: Microchip Technology Incorporated
    Inventors: Joseph Fernandez, Rangsun Kitnarong, Tarapong Soontornvipart, Janwit Apirukaramwong, Prachit Punyapor, Supakrits Suttiwat, Ekgachai Kenganantanon