Patents by Inventor Suprotik Das

Suprotik Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR DISPENSING HOT MELT ADHESIVES
    Publication number: 20180163091
    Abstract: A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
    Type: Application
    Filed: February 8, 2018
    Publication date: June 14, 2018
    Inventors: Suprotik Das, Sheenfar S. Fong, Akio Otsuka, Laurence B. Saidman
  • System and method for dispensing hot melt adhesives
    Patent number: 9920222
    Abstract: A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: March 20, 2018
    Assignee: Nordson Corporation
    Inventors: Suprotik Das, Sheenfar S. Fong, Akio Otsuka, Laurence B. Saidman
  • System and Method for Dispensing Hot Melt Adhesives
    Publication number: 20160122592
    Abstract: A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.
    Type: Application
    Filed: November 3, 2015
    Publication date: May 5, 2016
    Inventors: Suprotik Das, Sheenfar S. Fong, Akio Otsuka, Laurence B. SAIDMAN