Patents by Inventor Suraj Prakash Rawal

Suraj Prakash Rawal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10399711
    Abstract: Laminated carbon-carbon composites can be used as an ablative material, but they are often prone to delamination under thermally induced interlaminar shear and tension. Graded carbon-carbon composites with a sacrificial or ablative layer that is integral with one or more underlying layers and not fully dense can address these issues and provide other advantages. Such graded carbon-carbon composites can include a densified base layer containing a first portion of a carbonaceous matrix, and an outer ablative layer that is integral with the densified base layer and contains a second portion of the carbonaceous matrix. The carbonaceous matrix in the densified base layer has a first porosity, and the carbonaceous matrix in the outer ablative layer has a second porosity that is higher than that of the densified base layer. Methods for forming graded carbon-carbon composites can include heating a partially densified base layer and a carbonaceous matrix precursor above a carbonization temperature.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: September 3, 2019
    Assignee: Lockheed Martin Corporation
    Inventors: Suraj Prakash Rawal, William H. Willcockson, Wei Shih
  • Patent number: 6558785
    Abstract: The present invention discloses an insulated reentry heat shield for minimizing heat transfer to a spacecraft structure or the like during atmospheric reentry. The heat shield (10) comprises an outer heat resistant layer (12) including an ablative first material backed by an inner insulating layer (14) including an insulating second material. The outer and inner layers (12, 14) are bonded to one another by a middle layer (16) disposed therebetween. The middle layer is formed by disposing at least one layer of a phenolic loaded third material between the outer and inner layers and heating all three layers simultaneously to remove phenolic volatiles from the middle layer. In one embodiment, the ablative first material is carbon-carbon, the insulating second material is carbon foam, and the phenolic loaded third material is carbon scrim cloth. The present invention also discloses a method for use in constructing a heat shield.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: May 6, 2003
    Assignee: Lockheed Martin Corporation
    Inventors: Suraj Prakash Rawal, Janine M. Thornton, William H. Willcockson
  • Patent number: 5876831
    Abstract: A thermally conductive structure for transferring heat energy transversely, relative to a heat source interconnected to the structure, is disclosed. The structure generally includes a plurality of non-metallic thermal plugs insertable into a corresponding plurality of cells of a honeycomb core. Each of the thermal plugs are primarily axially thermally conductive. The honeycomb core is sandwiched between first and second panels, the heat source being mounted on the first panel. As such, the structure with high through the thickness thermal conductivity (e.g., greater than 200 W/m .degree.K) and conductance primarily transversely transfers heat energy from the heat source to the second panel via the plurality of thermal plugs.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: March 2, 1999
    Assignee: Lockheed Martin Corporation
    Inventor: Suraj Prakash Rawal