Patents by Inventor SURAJIT KUMAR
SURAJIT KUMAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240101506Abstract: The present invention discloses a continuous process for the synthesis of dimethyl carbonate from methanol and carbon dioxide over a ceria-based mixed metal oxide-silica catalyst formulation in the presence of a dehydrating or water trapping compound (2-Cyanopyridine).Type: ApplicationFiled: January 25, 2022Publication date: March 28, 2024Inventors: Darbha SRINIVAS, Vijay Vasant BOKADE, Prashant Suresh NIPHADKAR, Unnikrishnan PULIKKEEL, Snehalkumar PARMAR, Vinay AMTE, Surajit SENGUPTA, Asit Kumar DAS
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Patent number: 11919123Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.Type: GrantFiled: June 29, 2021Date of Patent: March 5, 2024Assignee: Applied Materials, Inc.Inventors: Surajit Kumar, Hari Soundararajan, Hui Chen, Shou-Sung Chang
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Patent number: 11769684Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.Type: GrantFiled: December 13, 2022Date of Patent: September 26, 2023Assignee: Applied Materials, Inc.Inventors: Tejas Ulavi, Vijay D. Parkhe, Naveen Kumar Nagaraja, Sanjeev Baluja, Surajit Kumar, Dhritiman Subha Kashyap, Ashutosh Agarwal
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Publication number: 20230297740Abstract: Embodiments disclosed herein include a method of modeling a rapid thermal processing (RTP) tool. In an embodiment, the method comprises developing a lamp model of an RTP tool, wherein the lamp model comprises a plurality of lamp zones, calculating an irradiance graph for the plurality of lamp zones, multiplying irradiance values of the plurality of lamp zones in the irradiance graph by a power of an existing RTP tool at a given time during a process recipe, summing the multiplied irradiance values for the plurality of lamp zones to form an irradiation graph of the lamp model, using the irradiation graph as an input to a machine learning algorithm, and outputting the temperature across a hypothetical substrate from the machine learning algorithm.Type: ApplicationFiled: March 15, 2022Publication date: September 21, 2023Inventors: Preetham Rao, Surajit Kumar, Dongming Iu, Wolfgang Aderhold
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Patent number: 11754603Abstract: The current density distribution is determined in an electronic device including a first and a second electrode, and a layer of a 2-dimensional conductive material extending between the first and second electrode. The total current through the electrodes is measured, and then a first current measurement probe is placed at a plurality of positions near the interface between the 2D material and the first electrode. The probe is coupled to the same voltage as the first electrode. The same is done at the interface between the channel and the second electrode, by placing a second probe coupled to the same voltage as the second electrode. The boundary conditions are determined for the current, and assuming that the current density vector is normal to the interfaces, this yields the boundary conditions for the current density vector. Finally, the continuity equation is solved, taking into account the boundary conditions.Type: GrantFiled: June 30, 2021Date of Patent: September 12, 2023Assignee: IMEC VZWInventor: Surajit Kumar Sutar
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Publication number: 20230230859Abstract: A batch processing chamber and a process kit for use therein are provided. The process kit includes an outer liner having an upper outer liner and a lower outer liner, an inner liner, and a top plate and a bottom plate attached to an inner surface of the inner liner. The top plate and the bottom plate form an enclosure together with the inner liner, and a cassette is disposed within the enclosure. The cassette including shelves configured to retain a plurality of substrates thereon. The inner liner has inlet openings disposed on an injection side of the inner liner and configured to be in fluid communication with a gas injection assembly of a processing chamber, and outlet openings disposed on an exhaust side of the inner liner and configured to be in fluid communication with a gas exhaust assembly of the processing chamber. The inner surfaces of the enclosure comprise material configured to cause black-body radiation within the enclosure.Type: ApplicationFiled: July 12, 2021Publication date: July 20, 2023Inventors: Adel George TANNOUS, Schubert S. CHU, Shu-Kwan LAU, Kartik Bhupendra SHAH, Zuoming ZHU, Ala MORADIAN, Surajit KUMAR, Srinivasa RANGAPPA, Chia Cheng CHIN, Vishwas Kumar PANDEY
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Publication number: 20230182259Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.Type: ApplicationFiled: February 8, 2023Publication date: June 15, 2023Inventors: Surajit Kumar, Hui Chen, Chih Chung Chou, Shou-Sung Chang
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Publication number: 20230167581Abstract: A process kit for use in a processing chamber includes an outer liner, an inner liner configured to be in fluid communication with a gas injection assembly and a gas exhaust assembly of a processing chamber, a first ring reflector disposed between the outer liner and the inner liner, a top plate and a bottom plate attached to an inner surface of the inner liner, the top plate and the bottom plate forming an enclosure together with the inner liner, a cassette disposed within the enclosure, the cassette comprising a plurality of shelves configured to retain a plurality of substrates thereon, and an edge temperature correcting element disposed between the inner liner and the first ring reflector.Type: ApplicationFiled: July 16, 2021Publication date: June 1, 2023Inventors: Kartik Bhupendra SHAH, Schubert S. CHU, Adel George TANNOUS, Ala MORADIAN, Nyi Oo MYO, Surajit KUMAR, Zuoming ZHU, Brian Hayes BURROWS, Vishwas Kumar PANDEY, Shu-Kwan LAU, Srinivasa RANGAPPA
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Publication number: 20230113057Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.Type: ApplicationFiled: December 13, 2022Publication date: April 13, 2023Applicant: Applied Materials, Inc.Inventors: Tejas Ulavi, Vijay D. Parkhe, Naveen Kumar Nagaraja, Sanjeev Baluja, Surajit Kumar, Dhritiman Subha Kashyap, Ashutosh Agarwal
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Patent number: 11577358Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.Type: GrantFiled: July 17, 2020Date of Patent: February 14, 2023Assignee: Applied Materials, Inc.Inventors: Surajit Kumar, Hui Chen, Chih Chung Chou, Shou-Sung Chang
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Publication number: 20220011355Abstract: The current density distribution is determined in an electronic device including a first and a second electrode, and a layer of a 2-dimensional conductive material extending between the first and second electrode. The total current through the electrodes is measured, and then a first current measurement probe is placed at a plurality of positions near the interface between the 2D material and the first electrode. The probe is coupled to the same voltage as the first electrode. The same is done at the interface between the channel and the second electrode, by placing a second probe coupled to the same voltage as the second electrode. The boundary conditions are determined for the current, and assuming that the current density vector is normal to the interfaces, this yields the boundary conditions for the current density vector. Finally, the continuity equation is solved, taking into account the boundary conditions.Type: ApplicationFiled: June 30, 2021Publication date: January 13, 2022Inventor: Surajit Kumar Sutar
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Publication number: 20210402552Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.Type: ApplicationFiled: July 17, 2020Publication date: December 30, 2021Inventors: Surajit Kumar, Hui Chen, Chih Chung Chou, Shou-Sung Chang
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Publication number: 20210402555Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.Type: ApplicationFiled: June 29, 2021Publication date: December 30, 2021Inventors: Surajit Kumar, Hari Soundararajan, Hui Chen, Shou-Sung Chang
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Patent number: 11209398Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.Type: GrantFiled: October 9, 2019Date of Patent: December 28, 2021Assignee: Applied Materials, Inc.Inventors: Chuang-Chia Lin, Surajit Kumar, Upendra Ummethala
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Patent number: 11021790Abstract: Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.Type: GrantFiled: July 25, 2019Date of Patent: June 1, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Zhepeng Cong, Schubert Chu, Nyi O. Myo, Kartik Shah, Surajit Kumar
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Publication number: 20210111059Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.Type: ApplicationFiled: October 9, 2020Publication date: April 15, 2021Applicant: Applies Materials, Inc.Inventors: Tejas Ulavi, Vijay D. Parkhe, Naveen Kumar Nagaraja, Sanjeev Baluja, Surajit Kumar, Dhritiman Subha Kashyap, Ashutosh Agarwal
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Publication number: 20210080431Abstract: Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.Type: ApplicationFiled: October 9, 2019Publication date: March 18, 2021Inventors: Chuang-Chia Lin, Surajit Kumar, Upendra Ummethala
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Publication number: 20200040451Abstract: Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.Type: ApplicationFiled: July 25, 2019Publication date: February 6, 2020Inventors: Zhepeng CONG, Schubert CHU, Nyi O. MYO, Kartik SHAH, Surajit KUMAR
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Patent number: 10386126Abstract: Apparatus for controlling the thermal uniformity of a substrate can control the thermal uniformity of the substrate to be more uniform or to be non-uniform. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon. A flow path is disposed within the substrate support to flow a heat transfer fluid beneath the support surface. The flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length. The first portion is spaced about 2 mm to about 10 mm from the second portion. The first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.Type: GrantFiled: February 22, 2016Date of Patent: August 20, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Kallol Bera, Xiaoping Zhou, Douglas A. Buchberger, Jr., Andrew Nguyen, Hamid Tavassoli, Surajit Kumar, Shahid Rauf
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Patent number: 10132003Abstract: Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.Type: GrantFiled: July 21, 2017Date of Patent: November 20, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Surajit Kumar, Joseph M. Ranish, Zhiyuan Ye, Kartik Shah, Mehmet Tugrul Samir, Errol Antonio C. Sanchez