Patents by Inventor Surej RAVIKUMAR

Surej RAVIKUMAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-planar integrated circuit structures having asymmetric source and drain trench contact spacing
    Patent number: 11621334
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication. In an example, an integrated circuit structure includes a fin including silicon. A gate structure is over the fin, the gate structure having a center. A conductive source trench contact is over the fin, the conductive source trench contact having a center spaced apart from the center of the gate structure by a first distance. A conductive drain trench contact is over the fin, the conductive drain trench contact having a center spaced apart from the center of the gate structure by a second distance, the second distance greater than the first distance by a factor of three.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: April 4, 2023
    Assignee: Intel Corporation
    Inventors: Said Rami, Hyung-Jin Lee, Surej Ravikumar, Kinyip Phoa
  • NON-PLANAR INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN TRENCH CONTACT SPACING
    Publication number: 20200243655
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication. In an example, an integrated circuit structure includes a fin including silicon. A gate structure is over the fin, the gate structure having a center. A conductive source trench contact is over the fin, the conductive source trench contact having a center spaced apart from the center of the gate structure by a first distance. A conductive drain trench contact is over the fin, the conductive drain trench contact having a center spaced apart from the center of the gate structure by a second distance, the second distance greater than the first distance by a factor of three.
    Type: Application
    Filed: January 29, 2019
    Publication date: July 30, 2020
    Inventors: Said RAMI, Hyung-Jin LEE, Surej RAVIKUMAR, Kinyip PHOA